Part Number | BZT52C33S |
Manufacturer | MDD |
Title | Surface mount zener diode |
Description | Surface mount zener diode BZT52C2V0S-BZT52C51S FEATURES z Planar die construction z General purpose, medium current Pb Lead-free z Ideally sui... |
Features |
z Planar die construction z General purpose, medium current
Pb
Lead-free
z Ideally suited for automated assembly processes
APPLICATIONS
z Zener diode z Ultra-small surface mount package
ORDERING INFORMATION
Type No.
BZT52C2V0S-BZT52C51S
Marking See table 2
SOD-323
Package Code SOD-323
MAXIMUM... |
Datasheet | BZT52C33S pdf datasheet |
Part Number | BZT52C33S |
Manufacturer | CDIL |
Title | SURFACE MOUNT SILICON ZENER DIODES |
Description | Maximum Forward Voltage Drop @ IF= 10mA Power Dissipation @ 25ºC Peak Forward Surge Current, 8.3ms Single Half Sine-WaveSuperimposed on Rated Load. |
Features |
.80 18.90 21.00 23.10 25.20 28.35 31.50 34.65 37.80 40.95 VF @ 10mA <0.9V Reverse Leakage Zener Impedance Current ZZK @ IZK ZZT @ IZT IR @ VR (mA) (mA) (V) (Ω ) (Ω ) (µ A) max max max 95 5.0 500 1.0 5.0 1.0 78 5.0 500 1.0 5.0 2.0 60 5.0 480 1.0 0.1 0.8 40 5.0 400 1.0 0.1 1.0 10 5.0 200 1.0 0.1 2.0 8. |
Datasheet | BZT52C33S pdf datasheet |
Part Number | BZT52C33S |
Manufacturer | WON-TOP |
Title | 200mW SURFACE MOUNT ZENER DIODE |
Description | ® WON-TOP ELECTRONICS BZT52C2V0S – BZT52C51S 200mW SURFACE MOUNT ZENER DIODE Pb Features Planar Die Construction 200mW Power Dissipation 2. |
Features |
Planar Die Construction 200mW Power Dissipation 2.0V – 51V Nominal Zener Voltage 5% Standard Vz Tolerance Designed for Surface Mount Application Plastic Material – UL Recognition Flammability Classification 94V-0 C A B Mechanical Data Case: SOD-323, Molded Plastic Terminals: Plate. |
Datasheet | BZT52C33S pdf datasheet |
Part Number | BZT52C33S |
Manufacturer | Kexin |
Title | (BZT52C2V0S - BZT52C39S) Surface Mount Zener Diodes |
Description | SMD Type Surface Mount Zener Diodes BZT52C2V0S - BZT52C39S Diodes Features Planar Die Construction Ultra-Small Surface Mount Package Ideally Sui. |
Features |
Planar Die Construction Ultra-Small Surface Mount Package Ideally Suited for Automated Assembly Processes
Absolute Maximum Ratings (Ta = 25 )
Parameter Power dissipation Thermal Resistance, Junction to Ambient Air Forward Voltage @ IF = 10mA R Symbol P
JA
Rating 200 625 0.9 150 -65 to +150
Unit m. |
Datasheet | BZT52C33S pdf datasheet |
Part Number | BZT52C33S |
Manufacturer | JGD |
Title | Surface Mount Zener Diodes |
Description | Features * Planar die construction * Ultra-Small Surface Mount Package * Ideally suited for automated assembly processes BZT52C2V4S THRU BZT52C75. |
Features |
* Planar die construction * Ultra-Small Surface Mount Package * Ideally suited for automated assembly processes
BZT52C2V4S THRU BZT52C75S
Surface Mount Zener Diodes
A C BD
Mechanical Data
* Case: SOD-323, Molded plastic * Terminals: Solderable per MIIL-STD-202, Method 208 * Polarity: Cathode Band
. |
Datasheet | BZT52C33S pdf datasheet |
Part Number | BZT52C33S |
Manufacturer | HOTTECH |
Title | Plastic-Encapsulate Diodes |
Description | Plastic-Encapsulate Diodes ZENER DIODES FEATURES Planar die construction General purpose, Medium current Ideally suited for automated assembly pr. |
Features |
Planar die construction General purpose, Medium current Ideally suited for automated assembly processes Available in Lead free version
BZT52C2V0S---BZT52C39S
-+
SOD-323
Maximum Ratings @ Ta=25℃ unless otherwise specified
Characteristic Forward Voltage
@ IF=10mA
Symbol VF
Value 0.9
Power Dissi. |
Datasheet | BZT52C33S pdf datasheet |
Since 2024. D4U Semiconductor. | Contact Us | Privacy Policy