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BZT52C33S

MDD
BZT52C33S
Part Number BZT52C33S
Manufacturer MDD
Title Surface mount zener diode
Description Surface mount zener diode BZT52C2V0S-BZT52C51S FEATURES z Planar die construction z General purpose, medium current Pb Lead-free z Ideally sui...
Features z Planar die construction z General purpose, medium current Pb Lead-free z Ideally suited for automated assembly processes APPLICATIONS z Zener diode z Ultra-small surface mount package ORDERING INFORMATION Type No. BZT52C2V0S-BZT52C51S Marking See table 2 SOD-323 Package Code SOD-323 MAXIMUM...

Datasheet BZT52C33S pdf datasheet



BZT52C33S

CDIL
BZT52C33S
Part Number BZT52C33S
Manufacturer CDIL
Title SURFACE MOUNT SILICON ZENER DIODES
Description Maximum Forward Voltage Drop @ IF= 10mA Power Dissipation @ 25ºC Peak Forward Surge Current, 8.3ms Single Half Sine-WaveSuperimposed on Rated Load.
Features .80 18.90 21.00 23.10 25.20 28.35 31.50 34.65 37.80 40.95 VF @ 10mA <0.9V Reverse Leakage Zener Impedance Current ZZK @ IZK ZZT @ IZT IR @ VR (mA) (mA) (V) (Ω ) (Ω ) (µ A) max max max 95 5.0 500 1.0 5.0 1.0 78 5.0 500 1.0 5.0 2.0 60 5.0 480 1.0 0.1 0.8 40 5.0 400 1.0 0.1 1.0 10 5.0 200 1.0 0.1 2.0 8.

Datasheet BZT52C33S pdf datasheet




BZT52C33S

WON-TOP
BZT52C33S
Part Number BZT52C33S
Manufacturer WON-TOP
Title 200mW SURFACE MOUNT ZENER DIODE
Description ® WON-TOP ELECTRONICS BZT52C2V0S – BZT52C51S 200mW SURFACE MOUNT ZENER DIODE Pb Features  Planar Die Construction  200mW Power Dissipation  2.
Features
 Planar Die Construction
 200mW Power Dissipation
 2.0V
  – 51V Nominal Zener Voltage
 5% Standard Vz Tolerance
 Designed for Surface Mount Application
 Plastic Material
  – UL Recognition Flammability Classification 94V-0 C A B Mechanical Data
 Case: SOD-323, Molded Plastic
 Terminals: Plate.

Datasheet BZT52C33S pdf datasheet




BZT52C33S

Kexin
BZT52C33S
Part Number BZT52C33S
Manufacturer Kexin
Title (BZT52C2V0S - BZT52C39S) Surface Mount Zener Diodes
Description SMD Type Surface Mount Zener Diodes BZT52C2V0S - BZT52C39S Diodes Features Planar Die Construction Ultra-Small Surface Mount Package Ideally Sui.
Features Planar Die Construction Ultra-Small Surface Mount Package Ideally Suited for Automated Assembly Processes Absolute Maximum Ratings (Ta = 25 ) Parameter Power dissipation Thermal Resistance, Junction to Ambient Air Forward Voltage @ IF = 10mA R Symbol P JA Rating 200 625 0.9 150 -65 to +150 Unit m.

Datasheet BZT52C33S pdf datasheet




BZT52C33S

JGD
BZT52C33S
Part Number BZT52C33S
Manufacturer JGD
Title Surface Mount Zener Diodes
Description Features * Planar die construction * Ultra-Small Surface Mount Package * Ideally suited for automated assembly processes BZT52C2V4S THRU BZT52C75.
Features * Planar die construction * Ultra-Small Surface Mount Package * Ideally suited for automated assembly processes BZT52C2V4S THRU BZT52C75S Surface Mount Zener Diodes A C BD Mechanical Data * Case: SOD-323, Molded plastic * Terminals: Solderable per MIIL-STD-202, Method 208 * Polarity: Cathode Band .

Datasheet BZT52C33S pdf datasheet




BZT52C33S

HOTTECH
BZT52C33S
Part Number BZT52C33S
Manufacturer HOTTECH
Title Plastic-Encapsulate Diodes
Description Plastic-Encapsulate Diodes ZENER DIODES FEATURES Planar die construction General purpose, Medium current Ideally suited for automated assembly pr.
Features Planar die construction General purpose, Medium current Ideally suited for automated assembly processes Available in Lead free version BZT52C2V0S---BZT52C39S -+ SOD-323 Maximum Ratings @ Ta=25℃ unless otherwise specified Characteristic Forward Voltage @ IF=10mA Symbol VF Value 0.9 Power Dissi.

Datasheet BZT52C33S pdf datasheet





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