SMBB1550-1100

Data Sheet SMBB1550-1100 1550nm High Power TOP LED Outline and Internal Circuit (Unit : mm) Features Chip Material : InGaAsP Chip Dimension : 1000um * 1000um Number of Chips : 1pce Peak Wavelength : 1550nm typ. Lead Frame Die : Silver Plated on Copper Package Resin : PA9T Lens : Silicone Resin Application Absolute Maximum Ratings (Tc=25°C) Item Symbol Ratings Power Dissipation PD 1000 Forward Current IF 700 Pulse Forward Current IFP 2000 Reverse Voltage VR 3 Thermal Resistance Rthja 10 Junction Temperature Tj 120 Operating Temperature Topr -40 ~ +100 Storage Temperature Tstg -40 ~ +100 Soldering Temperature TSOL 250 ‡Pulse Forward Current condition : Duty 1% and Pulse Width=10us. ‡Soldering condition : Soldering condition must be completed with 5 seconds at 250°C. Optical and Electrical Characteristics (Tc=25°C) Parameter Symbol Min Typ Max Unit Forward Voltage VF VFP 1.0 1.4 1.5 Total Radiated Power PO 16 35 ...