Package Materials Encapsulating Resin Materials Electrodes Materials Weight Heat-Resistant Polymer (+) Silicone Resin (with diffuser and phosphor) + Ag-plated Copper Alloy 0.0026g(TYP) * 。 Dimensions do not include mold flash or metal burr. a) 。 This drawing does not guarantee that the dim.
v IF=20mA
x - IF=20mA Chromaticity Coordinate2
y - IF=20mA
Thermal Resistance
RθJS
-
* Characteristics at TA=25°C.
* Luminous Flux value as per CIE 127:2007 standard.
* Chromaticity Coordinates as per CIE 1931 Chromaticity Chart.
* RθJS is Thermal Resistance from junction to TS measuring point.
Typ 5.75
15
4.97 0.290 0.275 15.6
5.17 0.300 0.295
65
Max -
-
95
Unit V μA lm
cd lm
cd °C/W
1
RANKS
NICHIA STS-DA1-3631A
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