* 2 die to 7 die stack with spacer capability
* 5 x 5mm to 23 x 23mm body size
* Package height at 1.0, 1.2, 1.4 and 1.7mm max.
* Flexible die stacking op.
where Digital, Flash, SRAM, PSRAM and Logic are stacked into a single package.
APPLICATIONS
* Suitable for a variet.
STATS ChipPAC’s Fine Pitch Ball Grid Array Stacked Die (FBGA-SD) offering includes LFBGA-SD, TFBGA-SD, VFBGA-SD and WFBGA-SD packages. Tape versions of VFBGA-SD and TFBGA-SD are also available. STATS ChipPAC’s chip stack technology offers the flexibi.
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