SMB2EZ30D5 Datasheet

SMB2EZ30D5 Surface Mount Device

SMB2EZxxD5 SERIES Surface Mount Device 0.086 (2.20) 0.077 (1.95) 0.155 (3.94) 0.130 (3.30) 0.180 (4.57) 0.160 (4.06) 0.012 (0.305) 0.006 (0.152) 0.096 (2.44) 0.084 (2.13) 0.060 (1.52) 0.030 (0.76) 0.220 (5.59) 0.201 (5.10) 0.008 (0.203) Max. Ordering Information Part Number SMB2EZxxD5 SMB2EZxxD5-.

Features

‧Glass passivated chip ‧Low leakage ‧Built-in strain relief ‧Low inductance ‧High peak reverse power dissipation ‧Lead (Pb)-free component ‧For use in stabilizing and clipping circuits with high power rating ‧AEC-Q101 Qualified Mechanical Data ‧Case: DO-214AA (SMB) ‧Epoxy: UL 94V-0 rate flame retardant ‧Polarity: Laser band denotes cathode end ‧Weight: 0.095 grams (approximate) MAXIMUM RATINGS (TA=25°C unless otherwise noted) Parameter DC Power Dissipation at TL = 50 °C (Note1) Maximum Forward Voltage at IF = 200 mA. Junction Temperature Range Storage Temperature Range NOTE: 1. TL = Lead tem.