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1PGSMB5944

Taiwan Semiconductor

11V - 200V Surface Mount Silicon Zener Diode

1PGSMB5926 – 1PGSMB5956 Taiwan Semiconductor 3W, 11V - 200V Surface Mount Zener Diode FEATURES ● Photo Glass passivate...


Taiwan Semiconductor

1PGSMB5944

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Description
1PGSMB5926 – 1PGSMB5956 Taiwan Semiconductor 3W, 11V - 200V Surface Mount Zener Diode FEATURES ● Photo Glass passivated chip junction ● Ideal for automated placement ● Low inductance ● Moisture sensitivity level: level 1, per J-STD-020 ● RoHS Compliant ● Halogen-free according to IEC 61249-2-21 APPLICATIONS ● Switching mode power supply (SMPS) ● Adapters ● Lighting application ● On-board DC/DC converter KEY PARAMETERS PARAMETER VALUE UNIT VZ Test current IZT Ptot TJ MAX Package 11 - 200 V 1.9 - 34.1 mA 3 W 175 °C DO-214AA (SMB) Configuration Single die MECHANICAL DATA ● Case: DO-214AA (SMB) ● Molding compound meets UL 94V-0 flammability rating ● Terminal: Matte tin plated leads, solderable per J-STD-002 ● Meet JESD 201 class 2 whisker test ● Polarity: Indicated by cathode band ● Weight: 0.100g (approximately) DO-214AA (SMB) ABSOLUTE MAXIMUM RATINGS (TA = 25°C unless otherwise noted) PARAMETER DC power dissipation at TL=75°C, measure at zero lead length (Note 1) derate above 75°C Junction temperature Storage temperature Notes: 1. Mounted on Cu-Pad size 10mm x 10mm on PCB SYMBOL Ptot TJ TSTG VALUE 3 -55 to +175 -55 to +175 THERMAL PERFORMANCE PARAMETER SYMBOL TYP Junction-to-lead thermal resistance RӨJL 21 Junction-to-ambient thermal resistance RӨJA 59 Junction-to-case thermal resistance RӨJC 23 Thermal Performance Note: Units mounted on PCB (10mm x 10mm Cu pad test board) UNIT W °C °C UNIT °C/W °C/W °C/W 1 Version: C2102 1PGSMB5926 – 1PGS...




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