3D7503

3D7503 MONOLITHIC MANCHESTER ENCODER/DECODER (SERIES 3D7503) FEATURES All-silicon, low-power CMOS technology Encoder and decoder function independently Encoder has buffered clock output TTL/CMOS compatible inputs and outputs Vapor phase, IR and wave solderable Auto-insertable (DIP pkg.) Low ground bounce noise Maximum data rate: 50 MBaud Data rate range: ±15% Lock-in time: 1 bit CIN CEN RX COUT DIN RESB GND data 3 ® delay devices, inc. PACKAGES 1 2 3 4 5 6 7 14 13 12 11 10 9 8 VDD CBUF LOOP TXENB DOUTB TXB TX 3D7503-xxx DIP (.300) 3D7503G-xxx Gull Wing (.300) 3D7503D-xxx SOIC (.150) FUNCTIONAL DESCRIPTION The 3D7503 is a monolithic CMOS Manchester Encoder/Decoder combo chip. The device uses bi-phase-level encoding to embed a clock signal into a data stream for transmission across a communications link. In this encoding mode, a logic one is represented by a high-to-low transition in the center of the bit cell, while a logic zero is represented by a low-to-high transition. The Manchester encoder combines the clock (CIN) and data (DIN) into a single bi-phase-level signal (TX). An inverted version of this signal (TXB) is also available. The data baud rate (in MBaud) is equal to the input clock frequency (in MHz). A replica of the clock input is also available (CBUF). PIN DESCRIPTIONS Encoder: CIN Clock Input DIN Data Input RESB Reset CEN Clock buffer enable TXENB Transmit enable CBUF Buffered clock TX,TXB Transmitted signal Decoder: RX Received Signal COU...