5.0SMLJ11A THRU 5.0SMLJ400A
E480232
Features
• Low Inductance • Built in Strain Relief • For Surface Mount Application in Order to Optimize Board Space • High Temperature Soldering: 260°C/10 Seconds at Terminals • Typical ID:less than 1uA above 10V • Low Profile Package • Repetition Rate( duty cycle): 0.01% • Glass Passivated Junction • Excellent Clamping Capability • Halogen Free Available Upon Request By Adding Suffix "-HF" • Moisture Sensitivity Level 1 • Epoxy Meets UL 94 V-0 Flammability R.
TVS
5.0SMLJ11A THRU 5.0SMLJ400A
E480232
Features
• Low Inductance • Built in Strain Relief • For Surface Mount Application in Order to Optimize Board Space • High Temperature Soldering: 260°C/10 Seconds at Terminals • Typical ID:less than 1uA above 10V • Low Profile Package • Repetition Rate( duty cycle): 0.01% • Glass Passivated Junction • Excellent Clamping Capability • Halogen Free Available Upon Request By Adding Suffix "-HF" • Moisture Sensitivity Level 1 • Epoxy Meets UL 94 V-0 Flammability Rating
• Lead Free Finish/RoHS Compliant (Note1) ("P" Suffix Designates Compliant. See Ordering Information)
Mechanical Data
• Polarity: Color Band Denotes Positive End( cathode) Except Bi-directional Types
• Standard Packaging: 16mm Tape Per ( EIA 481) • Weight: 0.007 ounce, 0.21 gram
• Terminals: Solderable Per MIL-STD-750, Method 2026
Maximum Ratings
• Operating Junction Temperature Range: -55°C to +175°C • Storage Temperature Range: -55°C to +175°C
• Typical Thermal Resistance: 23°C/W Junction to Ambient
Peak Pulse Power
Surge Current on
IPPM
10/1000μs Waveform
See the Table Note 2
Peak Pulse Power Dissipation on 10/1000μs Waveform
PPPM
5000W(Min) Note 2,3
Power Dissipationon infinite heat sink
PD
6.5W
TL = 75°C.
Fast response time typically less than 1.0ps from 0 Volts to BV Min
Note: 1. High Temperature Solder Exemption Applied, see EU Directive Annex 7a.
2. Non-repetitive current pulse and derated above TA=25 °C 3. Mounted on 8.0mm2 copper pads to each terminal. Pin .