84-1LMISR4

TECHNICAL DATASHEET ELECTRICALLY CONDUCTIVE DIE ATTACH ADHESIVE DESCRIPTION ABLEBOND® 84-1LMISR4 electrically conductive die attach adhesive has been formulated for use in high throughput, automatic die attach equipment. The rheology of ABLEBOND 84-1LMISR4 adhesive allows minimum adhesive dispense and die put down dwell ABLEBOND® 84-1LMISR4 times, without tailing or stringing problems. The unique combination of adhesive properties makes this material one the most widely used die attach materials in the semiconductor industry. FEATURES Excellent dispensability with minimal tailing and stringing Box oven cure Test Method ATM-0018 ATM-0089 ATM-0067 ATM-0068 Test Description 10 x 10 mm Si die on glass slide Test Method ATM-0031 Typical Uncured Properties Filler Type Viscosity @ 25ºC Thixotropic Index www.DataSheet4U.com ABLEBOND 84-1LMISR4 Silver 8000 cP 5.6 18 hours 1 year ABLEBOND 84-1LMISR4 5.3% 1 hour @ 175ºC Test Description Brookfield CP51 @ 5 rpm Viscosity @ 0.5/Viscosity @ 5 rpm Physical worklife by % filler Work Life @ 25ºC Storage Life @ -40ºC Cure Process Data Weight Loss on Cure Recommended Cure Condition Alternate Cure Condition (1) (1) 3 - 5ºC / min ramp to 175ºC + 1 hour @ 175ºC The ramp was observed to yield reduced bondline voiding and increased strength The above cure profiles are guideline recommendations. Cure conditions (time and temperature) may vary based on customers’ experience and their application requirements, as well as customer curing...