| DatasheetsPDF.com |
ABS10 RECTIFIER Datasheet PDFSINGLE PHASE 0.8AMP SURFACE MOUNT GLASS PASSIVATED BRIDGE RECTIFIER SINGLE PHASE 0.8AMP SURFACE MOUNT GLASS PASSIVATED BRIDGE RECTIFIER |
　
　
　
| Part Number | ABS10 |
|---|---|
| Description | SINGLE PHASE 0.8AMP SURFACE MOUNT GLASS PASSIVATED BRIDGE RECTIFIER |
| Feature | Technical Data Data Sheet N1693, Rev. A ABS2 THRU ABS10 ABS2 THRU ABS10 SINGL E PHASE 0. 8AMP SURFACE MOUNT GLASS PASS IVATED BRIDGE RECTIFIER ABS Features ï‚· Glass passivated die construction ï ‚· Low forward voltage drop ï‚· High cu rrent capability ï‚· High surge current capability ï‚· Designed for surface mo unt application ï‚· Plastic material-UL flammability 94V-0 ï‚· This is a Pb ∠’ Free Device ï‚· All SMC parts are tra ceable to the wafer lot ï‚· Additional testing can be offered upon request Ci rcuit Diagram Mechanical Data ï‚· Case : SOPA-4, Molded plastic ABS ï‚· Termin als: Plated leads solderable per MIL-S . |
| Manufacture | SMC Diode |
| Datasheet |
|
|
　
　
　
　
　
　
| Part Number | ABS10 |
|---|---|
| Description | SURFACE MOUNT FAST SWITCHING RECTIFIER |
| Feature | Suntan® Su®
ABS1 THRU ABS10
SURFACE M OUNT FAST SWITCHING RECTIFIER REVERSE V OLTAGE 50 to 1000 Volts FORWARD CURRENT 1. 0 Ampere FEATU RE S â—†Glass passiv ated chip junction. â—†Ideal for surfac e mounted applications. â—†Low leakage. â—†High forward surge current capabili ty. â—†High temperature soldering guara nteed: 260℃/10 seconds at terminals. Mechanical Data â—†Case: Molded plastic body. â—†Epoxy: UL94V-0 rate flame ret ardant. â—†Polarity: Molded on body. â— †Lead: Plated terminals solderable per MIL-STD-202E method 208C. â—†Weight: 0. 003 ounce, 0. 1 gram. ABS Dimensions in inches and (millimeters) MAXIMUM RAT . |
| Manufacture | Suntan |
| Datasheet |
 |
　
　
　
　
　
　
| Part Number | ABS10 |
|---|---|
| Description | SINGLE-PHASE BRIDGE RECTIFIER |
| Feature | MOSPEC
ABS2 THRU ABS10
SINGLE-PHASE BR IDGE RECTIFIER
VOLTAGE RANGE 200 to 10 00 Volts
CURRENT
1. 0 Ampere FEATURES ＊Glass Passivated chip junction ＊H igh forward surge current capability ï¼ ŠIdeal for printed circuit board ＊Hig h temperature soldering guaranteed: 260 oc/10 second at 5 lbs. (2. 3kg) tension ABS . 028(0. 7) . 012(0. 3) . 006(0. 15) . 00 2(0. 05) . 177(4. 5) . 252(6. 4) . 169(4. 3) . 236(6. 0) . 010(0. 25) . 006(0. 15) MECHAN ICAL DATA ＊Case: Transfer molded plas tic ＊Epoxy: UL94V-O rate flame retard ant ＊Terminals：Lead Solderable Per MIL-STD-202 method 208 ＊Polarity：As Marking on Body ＊Mounting Positio . |
| Manufacture | Mospec |
| Datasheet |
 |
　
　
　
　
|
@ 2014 :: Datasheetspdf.com :: Semiconductors datasheet search & download site (Privacy Policy & Contact) |