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BAS86 Diodes Datasheet PDF200mW Small Signal Schottky Barrier Diodes 200mW Small Signal Schottky Barrier Diodes |
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| Part Number | BAS86 |
|---|---|
| Description | 200mW Small Signal Schottky Barrier Diodes |
| Feature | MCC
TM
Micro Commercial Components
omponents 20736 Marilla S treet Chatsworth !"# $
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Feat ures
β’ Moisture Sensitivity Level 1 β ’ This diode features low turn-on volt age β’ The devices are protected by a PN junction guard ring against excessiv e voltage, such as electrostatic discha rges β’ This diode is also available i n a DO-35 case with type designation BA T86 β’ Lead Free Finish/RoHS Compliant (Note 1) ("P" Suffix designates RoHS Co mpliant. See ordering information) Maxi mum Ratings Symbol VR IF IFRM Ptot RJA TJ TSTG Rating Continu . |
| Manufacture | MCC |
| Datasheet |
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| Part Number | BAS86 |
|---|---|
| Description | Schottky Diode |
| Feature | Features
For general purpose application s. This diode features low turn-on volt age. This device are protected by a PN junction guard ring against excessive v oltage, such as electrostatic discharge s Metal-on-silicon Schottky barrier dev ice which is protected by a PN junction guard ring. The low forward voltage dr op and fast switching make it ideal for protection of MOS devices, steering, b iasing and coupling diodes for fast swi tching and low logic level applications . This diode is also available in the D O-35 case with type designation BAT86. Mechanical Data Case: MiniMELF Glass Ca se (SOD-80) We . |
| Manufacture | GOOD-ARK |
| Datasheet |
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| Part Number | BAS86 |
|---|---|
| Description | Schottky barrier single diode |
| Feature | BAS86
Schottky barrier single diode
25 J uly 2012
Product data sheet
1. Produc t profile 1. 1 General description Plan ar Schottky barrier diode with an integ rated guard ring for stress protection, encapsulated in a small hermetically s ealed SOD80C glass Surface-Mounted Devi ce (SMD) package with tin-plated metal discs at each end. It is suitable for β automatic placementβ and as such it can withstand immersion soldering. 1. 2 Features and benefits β’ Low forward voltage β’ High breakdown voltage β’ Guard ring protected β’ Hermetically sealed glass SMD package. 1. 3 Applicat ions β’ Ultra high-speed sw . |
| Manufacture | nexperia |
| Datasheet |
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