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BUK213-50Y

NXP Semiconductors

(BUK213-50Y / BUK208-50Y) Single channel high-side TOPFET

BUK208-50Y; BUK213-50Y Single channel high-side TOPFET™ Rev. 02 — 06 June 2002 Product data 1. Product profile 1.1 Descr...


NXP Semiconductors

BUK213-50Y

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Description
BUK208-50Y; BUK213-50Y Single channel high-side TOPFET™ Rev. 02 — 06 June 2002 Product data 1. Product profile 1.1 Description www.DataSheet4U.com Monolithic temperature and overload protected single high-side power switch based on TOPFET™ Trench technology in a 5-pin surface mount or leadform plastic package. Product availability: BUK208-50Y in SOT263B-01 BUK213-50Y in SOT426 (D2-PAK). 1.2 Features s s s s s s s Very low quiescent current Power TrenchMOS™ Overtemperature protection Over and undervoltage protection Reverse battery protection Low charge pump noise Loss of ground protection s s s s s s s CMOS logic capability Negative load clamping Overload protection ESD protection for all pins Diagnostic status indication Operating voltage down to 5.5 V Current limitation. 1.3 Applications s 12 and 24V grounded loads s Inductive loads s High inrush current loads s Replacement for relays and fuses. 1.4 Quick reference data Table 1: Symbol RBLon IL IL(nom) IL(lim) VBG Quick reference data Parameter on-state resistance at 25 °C continuous load current nominal load current (ISO) limiting load current operating voltage Min 3.6 12 5.5 Max 100 8.5 24 35 Unit mΩ A A A V Philips Semiconductors BUK208-50Y; BUK213-50Y Single channel high-side TOPFET™ 2. Pinning information mb mb B S 1 2 3 4 5 I P L www.DataSheet4U.com MBL431 1 5 03pa56 MBL264 G Fig 1. Pinning; SOT426 (D2-PAK). Fig 2. Pinning; SOT263B-01. Fig 3. Symbol; (HSS) TOPFETTM. 2.1 Pin description Table 2: Sy...




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