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BYD77F

NXP

Ultra fast low-loss controlled avalanche rectifiers

DISCRETE SEMICONDUCTORS DATA SHEET book, halfpage M3D121 BYD77 series Ultra fast low-loss controlled avalanche recti...


NXP

BYD77F

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Description
DISCRETE SEMICONDUCTORS DATA SHEET book, halfpage M3D121 BYD77 series Ultra fast low-loss controlled avalanche rectifiers Product specification Supersedes data of 1996 May 24 1999 Nov 15 Philips Semiconductors Product specification Ultra fast low-loss controlled avalanche rectifiers FEATURES Glass passivated High maximum operating temperature Low leakage current Excellent stability Guaranteed avalanche energy absorption capability Shipped in 8 mm embossed tape Smallest surface mount rectifier outline. MAM061 BYD77 series hermetically sealed and fatigue free as coefficients of expansion of all used parts are matched. (1) Implotec is a trademark of Philips. DESCRIPTION Cavity free cylindrical glass SOD87 package through Implotec™(1) technology. This package is handbook, 4 columns k a Fig.1 Simplified outline (SOD87) and symbol. LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 134). SYMBOL VRRM BYD77A BYD77B BYD77C BYD77D BYD77E BYD77F BYD77G VR continuous reverse voltage BYD77A BYD77B BYD77C BYD77D BYD77E BYD77F BYD77G IF(AV) average forward current BYD77A to D BYD77E to G IF(AV) average forward current BYD77A to D BYD77E to G Ttp = 105 °C; see Figs 2 and 3; averaged over any 20 ms period; see also Figs 10 and 11 Tamb = 60 °C; PCB mounting (see Fig.16); see Figs 4 and 5; averaged over any 20 ms period; see also Figs 10 and 11 − − − − − − − − − − − 50 100 150 200 250 300 400 2.00 1.85 0.85 0.80 V V V V V V V A A A A PARAMETER re...




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