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BZT52-B2V7 Datasheet

Part Number BZT52-B2V7
Manufacturers nexperia
Logo nexperia
Description Single Zener diodes
Datasheet BZT52-B2V7 DatasheetBZT52-B2V7 Datasheet (PDF)

BZT52-B series Single Zener diodes in a SOD123 package Rev. 1 — 20 December 2017 Product data sheet 1 1 Product profile 1.1 General description General-purpose Zener diodes in a SOD123 small Surface-Mounted Device (SMD) plastic package. 1.2 Features and benefits • Total power dissipation: ≤ 590 mW • Wide working voltage range: nominal 2.4 V to 75 V (E24 range) • Small plastic package suitable for surface-mounted design • Low differential resistance • B selection • AEC-Q101 qualified 1.3 App.

  BZT52-B2V7   BZT52-B2V7






Part Number BZT52-B2V7
Manufacturers TIPTEK
Logo TIPTEK
Description SURFACE MOUNT ZENER DIODES
Datasheet BZT52-B2V7 DatasheetBZT52-B2V7 Datasheet (PDF)

BZT52-B2V0~BZT52-B36 SURFACE MOUNT ZENER DIODES FEATURES  PLANAR DIE CONSTRUCTION  POWER DISSIPATION  ZENER VOLTAGES FROM 2.0~36V  IDEALLY SUITED FOR AUTOMATED ASSEMBLY PROCESSES  BOTH NORMAL AND Pb FREE PRODUCT ARE AVAILABLE: NORMAL: 80~95% Sn , 5~20%Pb Pb FREE: 98.5% Sn ABOVE MECHANICAL DATA  CASE:SOD-123,MOLDED PLASTIC  TERMINALS:SOLDERABLE PER MIL-STD-202, METHOD 208  Pb-Free:BZT52-B2V0~BZT52-B36 Halogen Free:BZT52-B2V0-H ~ BZT52-B36-H CASE:SOD-123 DIMENSIONS IN MILLIMETERS AND (INCH.

  BZT52-B2V7   BZT52-B2V7







Single Zener diodes

BZT52-B series Single Zener diodes in a SOD123 package Rev. 1 — 20 December 2017 Product data sheet 1 1 Product profile 1.1 General description General-purpose Zener diodes in a SOD123 small Surface-Mounted Device (SMD) plastic package. 1.2 Features and benefits • Total power dissipation: ≤ 590 mW • Wide working voltage range: nominal 2.4 V to 75 V (E24 range) • Small plastic package suitable for surface-mounted design • Low differential resistance • B selection • AEC-Q101 qualified 1.3 Applications • General regulation functions 1.4 Quick reference data Table 1. Quick reference data Symbol Parameter VF forward voltage Ptot total power dissipation Conditions IF = 10 mA Tamb ≤ 25 °C Min [1] [2] [3] - [1] Pulse test: tp ≤ 300 μs; δ ≤ 0.02. [2] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard footprint. [3] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1 cm2. .


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