CD4011UBM

Data sheet acquired from Harris Semiconductor SCHS022D – Revised September 2003 The CD4011UB types are supplied in 14-lead hermetic dual-in-line ceramic packages (F3A suffix), 14-lead dual-in-line plastic packages (E suffix), 14-lead small-outline packages (M, MT, M96, and NSR suffixes), and 14-lead thin shrink small-outline packages (PW and PWR suffixes). Copyright © 2003, Texas Instruments Incorporated PACKAGE OPTION ADDENDUM www.ti.com 4-Feb-2021 PACKAGING INFORMATION Orderable Device Status Package Type Package Pins Package Eco Plan (1) Drawing Qty (2) CD4011UBE CD4011UBEE4 CD4011UBF CD4011UBM CD4011UBM96 CD4011UBMT CD4011UBNSR CD4011UBPWR ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE PDIP PDIP CDIP SOIC SOIC SOIC SO TSSOP N 14 25 RoHS & Green N 14 25 RoHS & Green J 14 1 Non-RoHS & Green D 14 50 RoHS & Green D 14 2500 RoHS & Green D 14 250 RoHS & Green NS 14 2000 RoHS & Green PW 14 2000 RoHS & Green Lead finish/ Ball material (6) NIPDAU NIPDAU SNPB NIPDAU NIPDAU NIPDAU NIPDAU NIPDAU MSL Peak Temp Op Temp (°C) (3) N / A for Pkg Type N / A for Pkg Type N / A for Pkg Type -55 to 125 -55 to 125 -55 to 125 Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM -55 to 125 -55 to 125 -55 to 125 -55 to 125 -55 to 125 Device Marking (4/5) CD4011UBE CD4011UBE CD4011UBF CD4011UBM CD4011UBM CD4011UBM CD4011UB CM011UB (1) The marketing status values are defined as follows: ACTIVE: Product device...