CD4027BF

Data sheet acquired from Harris Semiconductor SCHS032C − Revised October 2003 The CD4027B types are supplied in 16-lead hermetic dual-in-line ceramic packages (F3A suffix), 16-lead dual-in-line plastic packages (E suffix), 16-lead small-outline packages (M, M96, MT, and NSR suffixes), and 16-lead thin shrink small-outline packages (PW and PWR suffixes). Copyright  2003, Texas Instruments Incorporated www.ti.com PACKAGE OPTION ADDENDUM 14-May-2021 PACKAGING INFORMATION Orderable Device CD4027BE Status Package Type Package Pins Package Eco Plan (1) Drawing Qty (2) ACTIVE PDIP N 16 25 RoHS & Green Lead finish/ Ball material (6) NIPDAU MSL Peak Temp Op Temp (°C) (3) N / A for Pkg Type -55 to 125 CD4027BEE4 ACTIVE PDIP N 16 25 RoHS & Green NIPDAU N / A for Pkg Type -55 to 125 CD4027BF CD4027BF3A CD4027BM ACTIVE ACTIVE ACTIVE CDIP CDIP SOIC J 16 1 Non-RoHS & Green J 16 1 Non-RoHS & Green D 16 40 RoHS & Green SNPB SNPB NIPDAU N / A for Pkg Type -55 to 125 N / A for Pkg Type -55 to 125 Level-1-260C-UNLIM -55 to 125 CD4027BM96 ACTIVE SOIC D 16 2500 RoHS & Green NIPDAU Level-1-260C-UNLIM -55 to 125 CD4027BM96E4 ACTIVE SOIC D 16 2500 RoHS & Green NIPDAU Level-1-260C-UNLIM -55 to 125 CD4027BME4 ACTIVE SOIC D 16 40 RoHS & Green NIPDAU Level-1-260C-UNLIM -55 to 125 CD4027BMT ACTIVE SOIC D 16 250 RoHS & Green NIPDAU Level-1-260C-UNLIM -55 to 125 CD4027BNSR ACTIVE SO NS 16 2000 RoHS & Green NIPDAU Level-1-260C-UNLI...