PROCESS
Small Signal MOSFET Transistor
N-Channel Enhancement-Mode Transistor Chip
CP394R
www.DataSheet4U.com
PROCESS...
PROCESS
Small Signal
MOSFET Transistor
N-Channel Enhancement-Mode Transistor Chip
CP394R
www.DataSheet4U.com
PROCESS DETAILS Die Size Die Thickness Gate Bonding Pad Area Source Bonding Pad Area Top Side Metalization Back Side Metalization 15.7 x 15.7 MILS 3.9 MILS 3.9 x 3.9 MILS 9.1 x 8.1 MILS Al-Si - 35,000Å Au - 12,000Å
GEOMETRY GROSS DIE PER 6 INCH WAFER 95,400 PRINCIPAL DEVICE TYPES CEDM7004
R1 (22-March 2010)
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PROCESS
CP394R
Typical Electrical Characteristics
R1 (22-March 2010)
w w w. c e n t r a l s e m i . c o m
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