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CSPST08 Datasheet

Part Number CSPST08
Manufacturers California Micro Devices Corp
Logo California Micro Devices Corp
Description CHIP SCALE SERIES TERMINATION ARRAY
Datasheet CSPST08 DatasheetCSPST08 Datasheet (PDF)

CALIFORNIA MICRO DEVICES Chip Scale Series Termination Array Features • 8 or 16 integrated high frequency series terminations • Ultra small footprint Chip Scale Package • Ceramic substrate • 0.35mm Eutectic Solder Bumps, 0.65mm pitch Applications • Series resistive bus termination • Isolated resistor array CSPST Product Description The CSPST is a high performance Integrated Passive Device (IPD) which provides series terminations suitable for use in high speed bus applications. Eight (8) or .

  CSPST08   CSPST08






CHIP SCALE SERIES TERMINATION ARRAY

CALIFORNIA MICRO DEVICES Chip Scale Series Termination Array Features • 8 or 16 integrated high frequency series terminations • Ultra small footprint Chip Scale Package • Ceramic substrate • 0.35mm Eutectic Solder Bumps, 0.65mm pitch Applications • Series resistive bus termination • Isolated resistor array CSPST Product Description The CSPST is a high performance Integrated Passive Device (IPD) which provides series terminations suitable for use in high speed bus applications. Eight (8) or sixteen (16) series termination versions are provided. These resistors provide excellent high frequency performance in excess of 3GHz and are manufactured to an absolute tolerance as low as ±1%. The Chip Scale Package provides an ultra small footprint for this IPD and provides minimal parasitics compared to conventional packaging. Typical bump inductance is less than 25pH. The large solder bumps and ceramic substrate allow for standard attachment to laminate printed circuit boards .


2005-03-24 : 74HCT7046A    CS4952    CS4953    CS4954    CS4955    CS50D    CS50S    CS5101    CS5101A    CS51021   


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