D20

D10, D15, D20, D22, C20, C30 MICROMODULES Memory Micromodules General Information for D1, D2 and C Packaging s Micromodules were developed specifically for embedding in Smartcards and Memory Cards The Micromodule provides: – Support for the chip – Electrical contacts – Suitable embedding interface for gluing the module to the plastic package potting side contact side s D15 s Physical dimensions and contact positions compliant to the ISO 7816 standard 1 1 1 1 s Micromodules delivered as a continuous Super 35 mm tape. (This differs from the standard 35 mm tape in the spacing distance between the indexing holes.) D10 D20 1 1 1 1 DESCRIPTION Memory Cards consist of two main parts: the plastic card, and the embedded Micromodule (which, in turn, carries the silicon chip). The plastic card is made of PVC, ABS or similar material, and can be over-printed with graphics, text, and magnetic strips. The Micromodule is embedded in a cavity in the plastic card. The Micromodules are mounted on Super 35 mm metallized epoxy tape, and are delivered on reels. These contain all of the chips from a number of wafers, including those chips that were found to be non-functioning during testing. Traceability is ensured by a label fixed on the reel. D22 C30 C20 Table 1. Memory Card and Memory Tag Integrated Circuits Module D10 D15 D20 D22 C30 C20 Please see the data briefing sheets of these products for example illustrations of these micromodules ST1200, ST1305B, ST1331, ST1333, ST1335, ...