EMSBC

THIN FILM EMSBC SERIES EMSBC SERIES The EMSBC series back contact chip resistor offers a space-saving design in a 0.020" x 0.020" size that requires only one wire bond. The chip backside provides the other contact with eutectic or conductive epoxy attachment to the substrate. Wire bonding is made to the notched pad on top of the chip. EMSBC's offer the high stability , low noise, and low T .C.R. of thin film while providing greater flexibility in hybrid stability, T.C.R. designs. Excellent for use in Vision Recognition Systems. CHIP RESISTORS MECHANICAL DA TA DAT SIZE SUBSTRA TE SUBSTRATE RESISTOR BOND PADS BACKSIDE SURFACE 0.020" x 0.020" x 0.010" (±0.003") SILICON TANT ALUM NITRIDE ANTALUM 15,000 Å ALUMINUM TYPICAL (GOLD BOND P ADS OPTIONAL) PADS GOLD; Suitable for eutectic or conductive epoxy bonding ELECTRICAL DA TA DAT RESIST ANCE RANGE RESISTANCE TOLERANCES T.C.R. Layout varies with value. 5 Ω TO 1.2M Ω 0.05%, 0.1%, 0.25%, 0.5% 1%, 2%, 5%, 10% (RESISTOR VALUE DEPENDENT) ±250ppm ST ANDARD; ±100ppm A vailable ≥ 500Ω, ≤ 250KΩ STANDARD; Available SERIES DA TA DAT CURRENT NOISE DIELECTRIC BREAKDOWN INSULA TION RESIST ANCE INSULATION RESISTANCE OPERA TING VOL OPERATING VOLT TAGE POWER RA TING RATING SHORT TERM OVERLOAD HIGH TEMP EXPOSURE THERMAL SHOCK MOISTURE RESIST ANCE RESISTANCE ST ABILITY STABILITY OPERA TING TEMP RANGE OPERATING STRA Y DISTRIBUTED STRAY CAP ACIT ANCE CAPACIT ACITANCE SILICON -35dB MAX. 100Ω TO 250KΩ TYPICAL -20dB MAX. < 100Ω OR > 250KΩ 400 V MIN. 10...