eGaN® FET DATASHEET
EPC2036 – Enhancement Mode Power Transistor
VDS , 100 V RDS(on) , 73 mΩ ID , 1.7 A
D G
S
EPC2036...
eGaN® FET DATASHEET
EPC2036 – Enhancement Mode Power Transistor
VDS , 100 V RDS(on) , 73 mΩ ID , 1.7 A
D G
S
EPC2036
EFFICIENT POWER CONVERSION
HAL
Gallium Nitride’s exceptionally high electron mobility and low temperature coefficient allows very
low RDS(on), while its lateral device structure and majority carrier diode provide exceptionally low QG and zero QRR. The end result is a device that can handle tasks where very high switching frequency, and low on-time are beneficial as well as those where on-state losses dominate.
Maximum Ratings
PARAMETER
VALUE UNIT
Drain-to-Source
Voltage (Continuous)
100
VDS Drain-to-Source
Voltage (up to 10,000 5 ms pulses at 150°C)
120
V
ID
Continuous (TA = 25°C, RθJA = 340°C/W) Pulsed (25°C, TPULSE = 300 µs)
Gate-to-Source
Voltage VGS Gate-to-Source
Voltage
1.7 A
18 6
V –4
TJ Operating Temperature TSTG Storage Temperature
–40 to 150 °C
–40 to 150
Thermal Characteristics
PARAMETER
TYP
UNIT
RθJC Thermal Resistance, Junction-to-Case
6
RθJB Thermal Resistance, Junction-to-Board
49
°C/W
RθJA Thermal Resistance, Junction-to-Ambient (Note 1)
100
Note 1: RθJA is determined with the device mounted on one square inch of copper pad, single layer 2 oz copper on FR4 board. See https://epc-co.com/epc/documents/product-training/Appnote_Thermal_Performance_of_eGaN_FETs.pdf for details
PARAMETER
Static Characteristics (TJ= 25°C unless otherwise stated) TEST CONDITIONS
BVDSS
Drain-to-Source
Voltage
VGS = 0 V, ID = 300 µA
ID...