FOR BOARD-TO-BOARD CONNECTION
240 SERIES (LOW-PROFILE STACKING)
s FEATURES
• The connectors can connect boards in parall...
FOR BOARD-TO-BOARD CONNECTION
240 SERIES (LOW-PROFILE STACKING)
s FEATURES
The connectors can connect boards in parallel (stacking) at intervals of 8 mm (0.31 in.) to 14 mm (0.55 in.) for various applications. Connectors with ten different numbers of contacts are available for various purposes: 20 to 100 in steps of ten and 120. Connectors are surface mount compatible. 1.27 mm (0.050 in.) pitch contact arrangement in two rows enables high-density mounting. Tails are spaced in a four-row staggered arrangement (2.54 mm × 1.905 mm) (0.100 in. × 0.075 in.) for easy patterning on PC boards. Bellows contacts ensure stable contact preventing pins from bending. The bellows contacts also have excellent stability with repeated insertion and extraction.
s SPECIFICATIONS
Item Operating temperature range Current rating
Voltage rating Contact resistance Insulation resistance Dielectric withstand
voltage Specifications –55°C to +105°C DC 1 A AC 250 V 35 mΩ max. (DC 6 V, 0.1 A) 1000 MΩ min. (DC 500 V) AC 750 V for 1 minute
s MATERIALS
Item Insulator Conductor Plating Materials Polyamide resin (94V-0) Copper alloy Contact Terminal Gold plating (PAGOS) Palladium plating
Specifications subject to change
Dimensions are in millimeters (inches)
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240 Series (Low-Profile Stacking)
s STACKING SPECIFICATIONS
Board interval (mm (in.)) 8 9 10 11* 12 13 14
Mounting dimensions
8 mm (0.315)
9 mm (0.354)
10 mm (0.394)
11 mm (0.433)
12 mm (0.472)
13 mm (0.512)
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