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FGI3236-F085

ON Semiconductor

IGBT

EcoSPARK) Ignition IGBT 20 mJ, 360 V, N−Channel Ignition IGBT FGB3236-F085, FGI3236-F085 Features • Industry Standard D...


ON Semiconductor

FGI3236-F085

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Description
EcoSPARK) Ignition IGBT 20 mJ, 360 V, N−Channel Ignition IGBT FGB3236-F085, FGI3236-F085 Features Industry Standard D2PAK Package SCIS Energy = 330 mJ at TJ = 25°C Logic Level Gate Drive AEC−Q101 Qualified and PPAP Capable RoHS Compliant Applications Automotive Ignition Coil Driver Circuits Coil On Plug Applications MAXIMUM RATINGS (TA = 25°C unless otherwise noted) Symbol Parameter Value Units BVCER Collector to Emitter Breakdown Voltage 360 (IC = 1 mA) BVECS Emitter to Collector Voltage − Reverse 24 Battery Condition (IC = 10 mA) ESCIS25 Self Clamping Inductive Switching Energy 320 (ISCIS = 14.7 A, L = 3.0 mHy, TJ = 25°C) ESCIS150 Self Clamping Inductive Switching Energy 160 (ISCIS = 10.4 A, L = 3.0 mHy, TJ = 150°C) IC25 Collector Current Continuous 44 at VGE = 4.0 V, TC = 25°C IC110 Collector Current Continuous 27 at VGE = 4.0 V, TC = 110°C VGEM Gate to Emitter Voltage Continuous ±10 PD Power Dissipation Total, at TC = 25°C 187 Power Dissipation Derating, for TC > 25°C 1.25 TJ Operating Junction Temperature Range −40 to +175 TSTG Storage Junction Temperature Range −40 to +175 TL Max. Lead Temperature for Soldering 300 (Leads at 1.6 mm from case for 10 s) V V mJ mJ A A V W W/°C °C °C °C TPKG Max. Lead Temperature for Soldering (Package Body for 10 s) 260 °C ESD Electrostatic Discharge Voltage at 100 pF, 1500 W 4 kV Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these li...




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