FMN1xD5SBB-50IA
FMN1xD5SBB-50IA
Stacked Multi-Chip Product (NAND=1G, DDR=512M)
Rev. 0.4, Jun. ‘15
Document Title Stacke...
FMN1xD5SBB-50IA
FMN1xD5SBB-50IA
Stacked Multi-Chip Product (NAND=1G, DDR=512M)
Rev. 0.4, Jun. ‘15
Document Title Stacked Multi-Chip Product (NAND=1G, DDR=512M)
Revision History
Revision No.
History
0.0 Initial Draft
0.1 Added Guarantee of the First block (NAND)
0.2 Added 67B FBGA Ball Assignments of NAND
0.3 Changed typical tPROG of NAND
0.4 Added Block zero retention of NAND(1K with ECC)
FMN1xD5SBB-50IA
Draft date Sep. 1st, 2014 Oct. 27th, 2014 Nov. 1st, 2014 Feb. 11th, 2015 Jun. 1st, 2015
Remark Preliminary
Final
Rev. 0.4, Jun. ‘15
Stacked Multi-Chip Product(MCP)
1.8V NAND Flash Memory and Mobile DDR
FMN1xD5SBB-50IA
1. MCP Features
Supply
Voltages : 1.8V Operation - VCC : 1.7V~1.95V for Core/IO Power
Operating Temperature Range - Industrial Part : -40°C ~ 85°C
Package Type : - 130-ball FBGA, 8.0x9.0mm2, 1.0T, 0.65mm Ball Pitch - Lead & Halogen Free
2. MCP Selection Guide
MCP Part Number Flash FMN1SD5SBB-50IA 1Gb x16 FMN1ED5SBB-50IA 1Gb x8
LP-DRAM...
