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FQA6N90C-F109

ON Semiconductor

N-Channel MOSFET

FQA6N90C-F109 — N-Channel QFET® MOSFET FQA6N90C-F109 N-Channel QFET® MOSFET 900 V, 6 A, 2.3 Ω Features • 6 A, 900 V, RD...


ON Semiconductor

FQA6N90C-F109

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Description
FQA6N90C-F109 — N-Channel QFET® MOSFET FQA6N90C-F109 N-Channel QFET® MOSFET 900 V, 6 A, 2.3 Ω Features 6 A, 900 V, RDS(on) = 2.3 Ω (Max.) @ VGS = 10 V, ID = 3 A Low Gate Charge (Typ. 30 nC) Low Crss (Typ. 11 pF) 100% Avalanche Tested RoHS Compliant Description This N-Channel enhancement mode power MOSFET is produced using ON Semiconductor’s proprietary planar stripe and DMOS technology. This advanced MOSFET technology has been especially tailored to reduce on-state resistance, and to provide superior switching performance and high avalanche energy strength. These devices are suitable for switched mode power supplies, active power factor correction (PFC), and electronic lamp ballasts. D G D S TO-3PN Absolute Maximum Ratings TC = 25°C unless otherwise noted. Symbol Parameter VDSS ID IDM VGSS EAS IAR EAR dv/dt PD TJ, TSTG TL Drain-Source Voltage Drain Current Drain Current - Continuous (TC = 25°C) - Continuous (TC = 100°C) - Pulsed Gate-Source Voltage Single Pulsed Avalanche Energy Avalanche Current Repetitive Avalanche Energy Peak Diode Recovery dv/dt Power Dissipation (TC = 25°C) - Derate above 25°C Operating and Storage Temperature Range Maximum lead temperature for soldering purposes, 1/8 from case for 5 seconds Thermal Characteristics Symbol RθJC RθCS RθJA Parameter Thermal Resistance, Junction-to-Case, Max. Thermal Resistance, Case-to-Sink, Typ. Thermal Resistance, Junction-to-Ambient, Max G S (Note 1) (Note 2) (Note 1) (Note 1) (Note 3)...




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