Capacitors. GA255DB3E2104MY02L Datasheet

GA255DB3E2104MY02L Datasheet PDF

Part GA255DB3E2104MY02L
Description (GA255D) Chip Monolithic Caramic Capacitors
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GA255DB3E2104MY02L
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C02E9.pdf 02.4.27
TThhisisccaatatalologghhaassoonnlylytytyppicicaal lssppeeccififciacatiotionns.sTbheecraeufosree,thyeorue aisrenroesqpuaecsetefdortodaeptapilreodvespoeucripficroadtiuocntss.pTehceifriecafotiroen, polretaosteraanpsparcotvteheouarpprodvaulcst hsepetcfifoicraptrionduocrt tsrapnescaificctatihoen abpepfororevaolrdsehreinegt .for product specification before ordering.
Chip Monolithic Ceramic Capacitors
AC250V Type (Which Meet Japanese Low)
s Features
1. Chip monolitic ceramic capacitor for AC line.
2. A new monolithic structure for small, high-
capacitance capable of operating at high-voltage
levels.
3. Sn-plated external electrodes realize good
solderability.
4. Only for Reflow soldering.
5. Capacitance 0.01 to 0.1 uF for connecting lines and
470 to 4700 pF for connecting line to earth.
s Applications
Noise suppression filters for switching power supplies,
telephones, facsimiles, modems.
s Refference srandard
JIS C 5102
JIS C 5150
The standards of the electrical appliance and material
safety law of Japan, separated table 4.
ege
LW
Part Number
GA252D
GA255D
L
5.7 ±0.4
Dimensions (mm)
W T e min.
2.8 ±0.3
5.0 ±0.4
2.0 ±0.3
0.3
g min.
3.5
Part Number
GA252DB3E2471MY02L
GA252DB3E2102MY02L
GA252DB3E2222MY02L
GA252DB3E2472MY02L
GA252DB3E2103MY02L
GA252DB3E2223MY02L
GA252DB3E2473MY02L
GA255DB3E2104MY02L
Rated Voltage
(V)
AC250 (r.m.s.)
AC250 (r.m.s.)
AC250 (r.m.s.)
AC250 (r.m.s.)
AC250 (r.m.s.)
AC250 (r.m.s.)
AC250 (r.m.s.)
AC250 (r.m.s.)
TC Code
B
B
B
B
B
B
B
B
Capacitance
Length L Width W Thickness T
(mm) (mm)
(mm)
470pF +20,-20%
1000pF +20,-20%
2200pF +20,-20%
4700pF +20,-20%
10000pF +20,-20%
22000pF +20,-20%
47000pF +20,-20%
0.1µF +20,-20%
5.7
5.7
5.7
5.7
5.7
5.7
5.7
5.7
2.8
2.8
2.8
2.8
2.8
2.8
2.8
5.0
2.0
2.0
2.0
2.0
2.0
2.0
2.0
2.0
Electrode g
(mm)
3.5 min.
3.5 min.
3.5 min.
3.5 min.
3.5 min.
3.5 min.
3.5 min.
3.5 min.
Electrode e
(mm)
0.3 min.
0.3 min.
0.3 min.
0.3 min.
0.3 min.
0.3 min.
0.3 min.
0.3 min.
17
108
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GA255DB3E2104MY02L
!Note PPleleaasseerreeaaddrraatitninggaanndd!!CCAAUUTTIOIONN((foforrsstotorraaggeeaannddooppeerraatitningg,,rraatitningg,,ssooldldeerrininggaannddmmoouunntitningg,,hhaannddlilningg))ininththisisPcDatFalcoagtatolopgrteovepnretvsemnot ksimngokaindg/oarndb/uorrnbinugr,neintgc., etc.
C02E9.pdf 02.4.27
TThhisisccaatatalologghhaassoonnlylytytyppicicaal lssppeeccififciacatiotionns.sTbheecraeufosree,thyeorue aisrenroesqpuaecsetefdortodaeptapilreodvespoeucripficroadtiuocntss.pTehceifriecafotiroen, polretaosteraanpsparcotvteheouarpprodvaulcst hsepetcfifoicraptrionduocrt tsrapnescaificctatihoen abpepfororevaolrdsehreinegt .for product specification before ordering.
Specifications and Test Methods
No. Item
Specification
1
Operating
Temperature Range
2 Appearance
3 Dimensions
Y25 to W85D
No defects or abnormalities.
Within the specified dimensions.
4 Dielectric Strength No defects or abnormalities.
5
Insulation Resistance
(I.R.)
More than 2,000M
6 Capacitance
Within the specified tolerance.
7
Dissipation
Factor (D.F.)
0.025 max.
Capacitance
8 Temperature
Characteristics
Cap. Change
Within T10%
Discharge
Test
(Application:
9 Nominal
Appearance No defects or abnormalities.
Capacitance
CF10,000pF)
10
Adhesive Strength
of Termination
No removal of the terminations or other defects shall occur.
Appearance No defects or abnormalities.
Capacitance Within the specified tolerance.
11
Vibration
Resistance
D.F.
0.025 max.
Test Method
Y
Visual inspection.
Using calipers.
No failure shall be observed when voltage as table is applied
between the terminations for 60T1 s, provided the
charge/discharge current is less than 50mA.
Nominal Capacitance
CU10,000pF
CF10,000pF
Test voltage
AC575V (r.m.s.)
AC1500V (r.m.s.)
The insulation resistance shall be measured with 500T50V and
within 60T5 s of charging.
The capacitance/D.F. shall be measured at 20D at a frequency of
1T0.2kHz and a voltage of 1T0.2V (r.m.s.)
#Pretreatment
Perform
a
heat
treatment
at
150
W00
Y10
D
for
60T5
min
and then
let sit for 24T2 h at room condition.
The range of capacitance change compared with the 20D value
within Y25 to W85D shall be within the specified range.
#Pretreatment
Perform
a
heat
treatment
at
150
W00
Y10
D
for
60T5
min
and then
let sit for 24T2 h at room condition.
As in Fig., discharge is made 50 times at 5 s intervals from
the capacitor(Cd) charged at DC voltage of specified.
R3 R1
10kV
V
Cd
Ct R2
Ct : Capacitor under test Cd : 0.001µF
R1 : 1,000R2 : 100MR3 : Surge resistance
Solder the capacitor to the testing jig (glass epoxy board) shown
in Fig.1 using a eutectic solder. Then apply 10N force in the
direction of the arrow. The soldering shall be done either with an
iron or using the reflow method and shall be conducted with care
so that the soldering is uniform and free of defects such as heat
shock.
10N, 10T1s
Speed : 1.0mm/s
Glass Epoxy Board
Fig.1
Solder the capacitor to the test jig (glass epoxy board).
The capacitor shall be subjected to a simple harmonic motion
having a total amplitude of 1.5mm, the frequency being varied
uniformly between the approximate limits of 10 and 55Hz. The
frequency range, from 10 to 55Hz and return to 10Hz, shall be
traversed in approximately 1 min. This motion shall be applied for
a period of 2 h in each 3 mutually perpendicular directions (total
of 6 h).
17
Glass Epoxy Board
Solder resist
Cu
"Room condition" Temperature : 15 to 35D, Relative humidity : 45 to 75%, Atmosphere pressure : 86 to 106kPa
Continued on the following page.
109



GA255DB3E2104MY02L
!Note PPleleaasseerreeaaddrraatitninggaanndd!!CCAAUUTTIOIONN((foforrsstotorraaggeeaannddooppeerraatitningg,,rraatitningg,,ssooldldeerrininggaannddmmoouunntitningg,,hhaannddlilningg))ininththisisPcDatFalcoagtatolopgrteovepnretvsemnot ksimngokaindg/oarndb/uorrnbinugr,neintgc., etc.
C02E9.pdf 02.4.27
TThhisisccaatatalologghhaassoonnlylytytyppicicaal lssppeeccififciacatiotionns.sTbheecraeufosree,thyeorue aisrenroesqpuaecsetefdortodaeptapilreodvespoeucripficroadtiuocntss.pTehceifriecafotiroen, polretaosteraanpsparcotvteheouarpprodvaulcst hsepetcfifoicraptrionduocrt tsrapnescaificctatihoen abpepfororevaolrdsehreinegt .for product specification before ordering.
17
Specifications and Test Methods
Continued from the preceding page.
No. Item
Specification
Test Method
12 Deflection
13
Solderability of
Termination
Appearance
14
Humidity
Insulation
Capacitance
Change
D.F.
I.R.
Dielectric
Strength
Appearance
Capacitance
Change
Resistance
15 to Soldering
Heat
D.F.
I.R.
Dielectric
Strength
No cracking or marking defects shall occur.
LZW
(mm)
5.7Z2.8
5.7Z5.0
b
d
c
φ4.5
a
100 t : 1.6
Dimension (mm)
abc
4.5 8.0 3.2
4.5 8.0 5.6
Fig.2
d
1.0
75% of the terminations are to be soldered evenly and continuously.
No marking defects.
Within T15%
0.05 max.
More than 1,000M
Pass the item No.4.
No marking defects.
Within T10%
0.025 max.
More than 2,000M
Pass the item No.4.
Solder the capacitor to the testing jig (glass epoxy board) shown
in Fig.2 using a eutectic solder. Then apply a force in the
direction shown in Fig. 3. The soldering shall be done either with
an iron or using the reflow method and shall be conducted with
care so that the soldering is uniform and free of defects such as
heat shock.
R230
20 50 Pressurizing
speed : 1.0mm/s
Pressurize
Flexure=1
Capacitance meter
45 45
(in mm)
Fig.3
Immerse the capacitor in a solution of ethanol (JIS-K-8101) and
rosin (JIS-K-5902) (25% rosin in weight proportion).
Immerse in eutectic solder solution for 2T0.5 s at 235T5D.
Immersing speed : 25T2.5mm/s
The capacitor shall be subjected to 40T2D, relative humidity of
90 to 98% for 8 h, and then removed in room condition for 16 h
until 5 cycles.
Preheat the capacitor as table.
Immerse the capacitor in eutectic solder solution at 260T5D for
10T1 s. Let sit at room condition for 24T2 h, then measure.
#Immersing speed : 25T2.5mm/s
#Pretreatment
Perform
a
heat
treatment
at
150
W00
Y10
D
for
60T5
min
and
then
let sit for 24T2 h at room condition.
*Preheating
Step
1
2
Temperature
100D to 120D
170D to 200D
Time
1 min
1 min
Appearance No marking defects.
Capacitance
Change
Within T7.5%
D.F. 0.025 max.
I.R. More than 2,000M
16
Temperature
Cycle
Dielectric
Strength
Pass the item No.4.
Fix the capacitor to the supporting jig (glass epoxy board) shown
in Fig.4 using a eutectic solder.
Perform the five cycles according to the four heat treatments
listed in the following table.
Let sit for 24T2 h at room condition, then measure.
Step
1
2
3
4
Temperature (D)
Min. Operating Temp.T3
Room Temp.
Max. Operating Temp.T2
Room Temp.
Time (min)
30T3
2 to 3
30T3
2 to 3
#Pretreatment
Perform
a
heat
treatment
at
150
W00
Y10
D
for
60T5
min
and
then
let sit for 24T2 h at room condition.
Glass Epoxy Board
Solder resist
Cu
"Room condition" Temperature : 15 to 35D, Relative humidity : 45 to 75%, Atmosphere pressure : 86 to 106kPa
Fig.4
Continued on the following page.
110







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