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GBPC1510W Rectifiers Datasheet PDFBridge Rectifiers Bridge Rectifiers |
| Part Number | GBPC1510W |
|---|---|
| Description | Bridge Rectifiers |
| Feature | Bridge Rectifiers (Glass Passivated)
GB PC 12, 15, 25, 35 SERIES
Features
• I ntegrally Molded Heat−Sink Provided V ery Low Thermal Resistance for Maximum Heat Dissipation • Surge Overload Rat ings from 300 A to 400 A • Isolated V oltage from Case to Lead over 2500 V UL Certified, UL #E258596 • Termina ls Finish Material ♦ Silver (Solderab le per MIL−STD−202, Method 208 for the wire type GBPC−W package) ♦ Nic kel for GBPC package • Mounting Torqu e: 20 in−lbs Maximum • These are Pb −Free Devices Suffix “W” • Wire Lead Structure www. onsemi. com GBPC C ASE 160AD GBPC−W CASE 160AD PIN ASS IGNMENT GBPC . |
| Manufacture | ON Semiconductor |
| Datasheet |
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| Part Number | GBPC1510W |
|---|---|
| Description | Glass Passivated Bridge Rectifier |
| Feature | Elektronische Bauelemente
GBPC1510W
100 0V, 15A Glass Passivated Bridge Rectifi er
RoHS Compliant Product A suffix of “-C” specifies halogen-free
FEATUR ES
Surge overload 300 amperes peak Low forward voltage drop Mounting position Any Materials used carries U/L recogn ition
GBPCW
REF. A B C D Millimeter Min. Max. 28. 3 28. 8 28. 3 28. 8 17. 6 18. 6 17. 6 18. 6 REF. E F G H Millimeter Mi n. Max. 10. 9 11. 9 30. 5 Min. 7. 5 8. 5 0. 9 7 1. 07 MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS (Rating at 25°C ambien t temperature unless otherwis e specifi ed. Single phase, half wave, 60Hz, resi stive or inductive lo . |
| Manufacture | SeCoS |
| Datasheet |
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| Part Number | GBPC1510W |
|---|---|
| Description | Single Phase Glass Passivated Silicon Bridge Rectifier |
| Feature | GBPC1506T/W thru GBPC1510T/W
Single Pha se Glass Passivated Silicon Bridge Rect ifier
VRRM = 600 V - 1000 V IO = 15 A
Features
• Integrally molded heat si nk provides low thermal resistance for maximum heat dissipation • High surge current capability • Void-free junct ion soldering by using vacuum soldering • Universal 3-way terminals: snap on , wire-around, or P. C board mounting High temperature soldering guaranteed : 260⁰C/ 10 seconds at 5 lbs (2. 3 kg) tension • Not ESD Sensitive GBPC-T/ W Package Mechanical Data Case: Molded plastic with heat sink integrally moun ted in the bridge encapsulat . |
| Manufacture | GeneSiC |
| Datasheet |
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