H21A Datasheet


Part Number

H21A

Description

PHOTOTRANSISTOR OPTICAL INTERRUPTER SWITCH

Manufacture

Fairchild Semiconductor

Total Page 5 Pages
PDF Download
Download H21A Datasheet


Features Datasheet pdf H21A1 / H21A2 / H21A3 PHOTOTRANSISTOR OP TICAL INTERRUPTER SWITCH PACKAGE DIMENS IONS 0.972 (24.7) 0.957 (24.3) 0.472 (1 2.0) 0.457 (11.6) C L 0.249 (6.35) 0.24 3 (6.15) + E D + DESCRIPTION The H21A1 , H21A2 and H21A3 consist of a gallium arsenide infrared emitting diode couple d with a silicon phototransistor in a p lastic housing. The packaging system is designed to optimize the mechanical re solution, coupling efficiency, ambient light Ø 0.133 (3.4) Ø 0.126 (3.2) (2 X) C L 0.39 (1.00) 0.34 (0.85) 0.755 (19.2) 0.745 (18.9) .073 (1.85) .133 ( 3.38) 0.129 (3.3) 0.119 (3.0) Optical C L rejection, cost and reliability. T he gap in the housing provides a means of interrupting the signal with an opaq ue material, switching the output from an “ON” to an “OFF” state. 0.4 33 (11.0) 0.422 (10.7) SCHEMATIC 1 4 0.125 (3.2) 0.119 (3.0) C L .295 (7.5) .272 (6.9) 0.315 (8.0) FEATURES 0.110 (2.8) 0.091 (2.3) • Opaque housing • Low cost • .035” apertures • High IC(ON) 1. Derate power dissipation line.
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H21A Datasheet
H21A1 / H21A2 / H21A3
PHOTOTRANSISTOR
OPTICAL INTERRUPTER SWITCH
PACKAGE DIMENSIONS
0.249 (6.35)
0.243 (6.15)
.073 (1.85)
.133 (3.38)
0.972 (24.7)
0.957 (24.3)
0.472 (12.0)
0.457 (11.6)
CL
+D
E+
0.755 (19.2)
0.745 (18.9)
Ø 0.133 (3.4)
Ø 0.126 (3.2)
(2X)
CL
0.39 (1.00)
0.34 (0.85)
0.129 (3.3)
0.119 (3.0)
0.433 (11.0)
0.422 (10.7)
Optical
CL
0.125 (3.2)
0.119 (3.0)
.295 (7.5)
.272 (6.9)
CL
NOTES:
23
14
0.315 (8.0)
0.110 (2.8)
0.091 (2.3)
PIN 1 ANODE
PIN 2 CATHODE
PIN 3 COLLECTOR
PIN 4 EMITTER
0.020 (0.51) (SQ)
1. Dimensions for all drawings are in inches (mm).
2. Tolerance of ± .010 (.25) on all non-nominal dimensions
unless otherwise specified.
DESCRIPTION
The H21A1, H21A2 and H21A3 consist of a
gallium arsenide infrared emitting diode
coupled with a silicon phototransistor in a
plastic housing. The packaging system is
designed to optimize the mechanical
resolution, coupling efficiency, ambient light
rejection, cost and reliability. The gap in the
housing provides a means of interrupting the
signal with an opaque material, switching the
output from an “ON” to an “OFF” state.
SCHEMATIC
FEATURES
• Opaque housing
14
• Low cost
• .035” apertures
23
• High IC(ON)
1. Derate power dissipation linearly 1.33 mW/°C above 25°C.
2. RMA flux is recommended.
3. Methanol or isopropyl alcohols are recommended as cleaning
agents.
4. Soldering iron tip 1/16” (1.6mm) minimum from housing.
ABSOLUTE MAXIMUM RATINGS (TA = 25°C unless otherwise specified)
Parameter
Operating Temperature
Storage Temperature
Soldering Temperature (Iron)(2,3 and 4)
Soldering Temperature (Flow)(2 and 3)
INPUT (EMITTER)
Continuous Forward Current
Reverse Voltage
Power Dissipation (1)
OUTPUT (SENSOR)
Collector to Emitter Voltage
Emitter to Collector Voltage
Collector Current
Power Dissipation (TC = 25°C)(1)
Symbol
TOPR
TSTG
TSOL-I
TSOL-F
IF
VR
PD
VCEO
VECO
IC
PD
Rating
-55 to +100
-55 to +100
240 for 5 sec
260 for 10 sec
50
6
100
30
4.5
20
150
Unit
°C
°C
°C
°C
mA
V
mW
V
V
mA
mW
2001 Fairchild Semiconductor Corporation
DS300290 5/02/01
1 OF 5
www.fairchildsemi.com




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