DatasheetsPDF.com

HFD4N50 Datasheet

Part Number HFD4N50
Manufacturers SemiHow
Logo SemiHow
Description N-Channel MOSFET
Datasheet HFD4N50 DatasheetHFD4N50 Datasheet (PDF)

HFD4N50_HFU4N50 July 2005 HFD4N50 / HFU4N50 500V N-Channel MOSFET BVDSS = 500 V RDS(on) typ ȍ ID = 2.6 A FEATURES ‰ Originative New Design ‰ Superior Avalanche Rugged Technology ‰ Robust Gate Oxide Technology ‰ Very Low Intrinsic Capacitances ‰ Excellent Switching Characteristics ‰ Unrivalled Gate Charge : 13 nC (Typ.) ‰ Extended Safe Operating Area ‰ Lower RDS(ON) ȍ 7\S #9GS=10V ‰ 100% Avalanche Tested D-PAK I-PAK 2 1 3 HFD4N50 1 2 3 HFU4N50 1.Gate 2. Drain 3. Source Ab.

  HFD4N50   HFD4N50






N-Channel MOSFET

HFD4N50_HFU4N50 July 2005 HFD4N50 / HFU4N50 500V N-Channel MOSFET BVDSS = 500 V RDS(on) typ ȍ ID = 2.6 A FEATURES ‰ Originative New Design ‰ Superior Avalanche Rugged Technology ‰ Robust Gate Oxide Technology ‰ Very Low Intrinsic Capacitances ‰ Excellent Switching Characteristics ‰ Unrivalled Gate Charge : 13 nC (Typ.) ‰ Extended Safe Operating Area ‰ Lower RDS(ON) ȍ 7\S #9GS=10V ‰ 100% Avalanche Tested D-PAK I-PAK 2 1 3 HFD4N50 1 2 3 HFU4N50 1.Gate 2. Drain 3. Source Absolute Maximum Ratings TC=25୅ unless otherwise specified Symbol Parameter Value VDSS ID IDM VGS EAS IAR EAR dv/dt Drain-Source Voltage Drain Current Drain Current Drain Current – Continuous (TC = 25ఁ͚͑ – Continuous (TC = 100ఁ͚͑ – Pulsed (Note 1) Gate-Source Voltage Single Pulsed Avalanche Energy (Note 2) Avalanche Current (Note 1) Repetitive Avalanche Energy (Note 1) Peak Diode Recovery dv/dt (Note 3) 500 2.6 1.64 10.4 ρͤ͑͡ 440 2.6 4.5 4.5 PD TJ, TSTG TL Total Power Dissipation (TA=25ఁ) * Power Dissipation (TC = 25ఁ͚͑ ͑͑͑͑͑͑͑͑͑͑͑͑͑͑͑͑͑͑͑͑͑͑͑͑͑͑͑͑͞͵ΖΣΒΥΖ͑ΒΓΠΧΖ͑ͣͦఁ͑ Operating and Storage Temperature Range Maximum lead temperature for soldering purposes, 1/8” from case for 5 seconds 2.5 45 0.36 -55 to +150 300 Units V A A A V mJ A mJ V/ns W W W/ఁ͑ ఁ͑ ఁ͑ Thermal Resistance Characteristics Symbol Parameter RșJC Junction-to-Case RșJA Junction-to-Ambient* RșJA Junction-to-Ambient * When mounted on the minimum pad size recommended (PCB Mount) Typ. ---- Max. 2.7.


2015-06-07 : 85N3LH5    LCM1602B    LCM1602B    HFP640    HFP640    LC83010    HFS730    HFD6N40S    HFU6N40S    HFW11N40   


@ 2014 :: Datasheetspdf.com ::
Semiconductors datasheet search & download site (Privacy Policy & Contact)