Chip Silicon Rectifier
HFM301 THRU HFM307
Ultra fast recovery type
Formosa MS
SMC
0.276(7.0) 0.260(6.6) 0.012(0.3) Typ...
Chip Silicon Rectifier
HFM301 THRU HFM307
Ultra fast recovery type
Formosa MS
SMC
0.276(7.0) 0.260(6.6) 0.012(0.3) Typ.
Features
Plastic package has Underwriters Laboratory Flammability Classification 94V-O Utilizing Flame Retardant Epoxy Molding Compound. For surface mounted applications. Exceeds environmental standards of MIL-S-19500 / 228 Low leakage current.
0.032(0.8) Typ. 0.040(1.0) Typ. 0.152(3.8) 0.144(3.6)
0.189(4.8) 0.173(4.4)
0.244(6.2) 0.228(5.8)
0.087(2.2) 0.071(1.8)
Mechanical data
Case : Molded plastic, JEDEC DO-214AB Terminals : Solder plated, solderable per MIL-STD-750, Method 2026 Polarity : Indicated by c athode band Mounting P osition : Any Weight : 0.00585 ounce, 0.195 gram
0.040 (1.0) Typ.
Dimensions in inches and (millimeters)
MAXIMUM RATINGS (AT TA=25oC unless otherwise noted)
PARAMETER Forward rectified current Forward surge current CONDITIONS Ambient temperature = 55 C 8.3ms single half sine-wave superimposed on rate load (JEDEC methode) VR = VRRM TA = 25o C
o
Symbol IO IFSM
MIN.
TYP.
MAX. 3.0 100 10.0 300
UNIT A A uA uA
o
Reverse current Thermal resistance Diode junction capacitance Storage temperature
VR = VRRM TA = 100o C Junction to ambient f=1MHz and applied 4vDC reverse
voltage
IR Rq JA CJ TSTG -55 15 70
C / w pF
+150
o
C
SYMBOLS
MARKING CODE H31 H32 H33 H34 H35 H36 H37
V RRM
(V)
*1
V RMS
(V) 35 70 140 210 280 420 560
*2
VR
*3
VF
*4
T RR
*5
Operating temperature ( o C)
(V) 50 100 200 300 400 600 800
(V)
(nS...