HFP75N75
Mar 2007
HFP75N75
75V N-Channel MOSFET
BVDSS = 75 V RDS(on) typ Pȍ ID = 80 A
FEATURES
Originative New Design Superior Avalanche Rugged Technology Robust Gate Oxide Technology Very Low Intrinsic Capacitances Excellent Switching Characteristics Unrivalled Gate Charge : 77 nC (Typ.) Extended Safe Operating Area Lower RDS(ON) ȍ7\S #9GS=10V 100% Avalanche Tested
TO-220
1 2 3
1.Gate 2. Drain 3. Source D
G
S
Absolute Maximum Ratings TC=25 unless othe.
75V N-Channel MOSFET
HFP75N75
Mar 2007
HFP75N75
75V N-Channel MOSFET
BVDSS = 75 V RDS(on) typ Pȍ ID = 80 A
FEATURES
Originative New Design Superior Avalanche Rugged Technology Robust Gate Oxide Technology Very Low Intrinsic Capacitances Excellent Switching Characteristics Unrivalled Gate Charge : 77 nC (Typ.) Extended Safe Operating Area Lower RDS(ON) ȍ7\S #9GS=10V 100% Avalanche Tested
TO-220
1 2 3
1.Gate 2. Drain 3. Source D
G
S
Absolute Maximum Ratings TC=25 unless otherwise specified
Symbol
Parameter
Value
VDSS ID
IDM VGS EAS IAR EAR dv/dt
Drain-Source Voltage
Drain Current Drain Current Drain Current
– Continuous (TC = 25ఁ͚
– Continuous (TC = 100ఁ͚
– Pulsed
(Note 1)
Gate-Source Voltage
Single Pulsed Avalanche Energy
(Note 2)
Avalanche Current
(Note 1)
Repetitive Avalanche Energy
(Note 1)
Peak Diode Recovery dv/dt
(Note 3)
75 80 56 320 ρ20 1476 80 16 7.0
PD
TJ, TSTG TL
Power Dissipation (TC = 25ఁ͚ ͞ ͵ΖΣΒΥΖ͑ΒΓΠΧΖ͑ͣͦఁ
Operating and Storage Temperature Range
Maximum lead temperature for soldering purposes, 1/8” from case for 5 seconds
160 0.91 -55 to +175
300
Units V A A A V mJ A mJ
V/ns W W/ఁ ఁ
ఁ
Thermal Resistance Characteristics
Symbol RșJC RșCS
RșJA
Junction-to-Case
Parameter
Case-to-Sink
Junction-to-Ambient
Typ. -0.5 --
Max. 0.94
-62.5
Units ఁ͠Έ
క ΄Ͷ;ͺΈ͑Ͷ·͟Ͳ͢͝;ΒΣ͑ͣͨ͡͡
HFP75N75
Electrical Characteristics TC=25 qC unless otherwise specified
Symbol
Parameter
Test Conditions
Min Typ Max Units
On Characterist.