Converter. HS1-565ARH Datasheet

HS1-565ARH Datasheet PDF

Part HS1-565ARH
Description Radiation Hardened High Speed/ Monolithic Digital-to-Analog Converter
Feature Semiconductor HS-565ARH Radiation Hardened High Speed, Monolithic Digital-to-Analog Converter Descr.
Manufacture Intersil Corporation
Datasheet
Download HS1-565ARH Datasheet

Semiconductor HS-565ARH Radiation Hardened High Speed, Mono HS1-565ARH Datasheet
HS-565ARH-T Data Sheet July 1999 File Number 4607.1 Radiati HS1-565ARH-T Datasheet





HS1-565ARH
Semiconductor
HS-565ARH
March 1996
Radiation Hardened High Speed,
Monolithic Digital-to-Analog Converter
Features
Description
• Devices QML Qualified in Accordance with
MIL-PRF-38535
• Detailed Electrical and Screening Requirements
are Contained in SMD# 5962-96755 and Harris’ QM
Plan
• DAC and Reference on a Single Chip
• Pin Compatible with AD-565A and HI-565A
• Very High Speed: Settles to 0.50 LSB in 500ns Max
• Monotonicity Guaranteed Over Temperature
• 0.50 LSB Max Nonlinearity Guaranteed Over
Temperature
• Low Gain Drift (Max., DAC Plus Reference) 50ppm/oC
The HS-565ARH is a fast, radiation hardened 12-bit current out-
put, digital-to-analog converter. The monolithic chip includes a
precision voltage reference, thin-film R-2R ladder, reference
control amplifier and twelve high-speed bipolar current
switches.
The Harris Semiconductor Dielectric Isolation process provides
latch-up free operation while minimizing stray capacitance and
leakage currents, to produce an excellent combination of speed
and accuracy. Also, ground currents are minimized to produce a
low and constant current through the ground terminal, which
reduces error due to code-dependent ground currents.
HS-565ARH die are laser trimmed for a maximum integral nonlin-
earity error of ±0.25 LSB at +25oC. In addition, the low noise bur-
ied zener reference is trimmed both for absolute value and mini-
mum temperature coefficient.
• Total Dose Hardness to 100K RAD
±0.75 LSB Accuracy Guaranteed Over Temperature
(±0.125 LSB Typical at +25oC)
Applications
• High Speed A/D Converters
• Precision Instrumentation
• Signal Reconstruction
Functional Diagram
REF OUT VCC
43
+
-
REF 6 19.95K
IN
REF 5
GND
10V
IREF
0.5mA
3.5K
+
-
3K
BIP.
OFF.
8
9.95K
DAC
IO
(4X IREF
X CODE)
11 20V
SPAN
5K
10 10V
SPAN
5K
9
OUT
2.5K
7 12
-VEE PWR 24 . . . 13
GND MSB LSB
Ordering Information
PART NUMBER
5962R9675501VJC
5962R9675501VXC
HS1-565ARH (SAMPLE)
HS9-565ARH (SAMPLE)
TEMPERATURE RANGE
-55oC to +125oC
-55oC to +125oC
+25oC
+25oC
SCREENING LEVEL
MIL-PRF-38535 Level V
MIL-PRF-38535 Level V
Sample
Sample
PACKAGE
24 Lead SBDIP
24 Lead Ceramic Flatpack
24 Lead SBDIP
24 Lead Ceramic Flatpack
CAUTION: These devices are sensitive to electrostatic discharge. Users should follow proper IC Handling Procedures.
Copyright © Harris Corporation 1996
1
Spec Number 518795
File Number 3278.2



HS1-565ARH
Pinouts
HS-565ARH
HS1-565ARH
MIL-STD-1835 CDIP2-T24
(SBDIP)
TOP VIEW
NC 1
NC 2
VCC 3
REF OUT 4
REF GND 5
REF IN 6
-VEE 7
BIPOLAR RIN 8
IDAC OUT 9
10V SPAN 10
20V SPAN 11
PWR GND 12
24 BIT 1 IN (MSB)
23 BIT 2 IN
22 BIT 3 IN
21 BIT 4 IN
20 BIT 5 IN
19 BIT 6 IN
18 BIT 7 IN
17 BIT 8 IN
16 BIT 9 IN
15 BIT 10 IN
14 BIT 11 IN
13 BIT 12 IN (LSB)
NC
NC
VCC
REF OUT
REF GND
REF IN
-VEE
BIPOLAR RIN
IDAC OUT
10V SPAN
20V SPAN
PWR GND
H59-565ARH
MIL-STD-1835 CDFP4-F24
(CERAMIC FLATPACK)
TOP VIEW
1 24
2 23
3 22
4 21
5 20
6 19
7 18
8 17
9 16
10 15
11 14
12 13
BIT 1 IN
(MSB)
BIT 2 IN
BIT 3 IN
BIT 4 IN
BIT 5 IN
BIT 6 IN
BIT 7 IN
BIT 8 IN
BIT 9 IN
BIT 10 IN
BIT 11 IN
BIT 12 IN
(LSB)
Spec Number 518795
2




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