HSMD-H690

H Surface Mount Flip Chip LEDs Technical Data HSMX-H670 Series HSMX-H690 Series Features Improved Reliability Through Elimination of Internal Wire Bond -40 to 85°C Operating Temperature Range Small Size Industry Standard Footprint Diffused Optics Compatible with IR Solder Process Four Colors Available Available in 8 mm Tape on 7" (178 mm) Diameter Reels Applications Keypad Backlighting LCD Backlighting Symbol Backlighting Front Panel Indicator Description The HSMX-H670 and HSMX-H690 introduce a revolutionary concept to the world of LEDs. The internal flip chip construction eliminates the wire bond between the chip and printed circuit board. Consequently as a result of the robust construction, product reliability is greatly improved. The HSMX-H670 and HSMX-H690 are available in four colors. The HSMX-H670 adheres to the industry standard 2.0 x 1.25 mm footprint and is intended for designs where space is limited. The small size, low 1....