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HSMF-C116 Datasheet

Part Number HSMF-C116
Manufacturers Broadcom
Logo Broadcom
Description Ultra Small Surface Mount Tricolor ChipLED
Datasheet HSMF-C116 DatasheetHSMF-C116 Datasheet (PDF)

HSMF-C116 Ultra Small Surface Mount Tricolor ChipLED Data Sheet Description This ultra-small tricolor chipLED is designed for close pitch assembly and also for portable and wearables applications. The package uses high intensity red AlInGaP die and high intensity InGaN green and blue die. To improve contrast the PCB substrate has a black surface. Applications  Display  Backlighting  Indicator Features  LED with AlInGaP and InGaN die  Surface mount device with ultra small 1.0 × 1.0mm footp.

  HSMF-C116   HSMF-C116






Ultra Small Surface Mount Tricolor ChipLED

HSMF-C116 Ultra Small Surface Mount Tricolor ChipLED Data Sheet Description This ultra-small tricolor chipLED is designed for close pitch assembly and also for portable and wearables applications. The package uses high intensity red AlInGaP die and high intensity InGaN green and blue die. To improve contrast the PCB substrate has a black surface. Applications  Display  Backlighting  Indicator Features  LED with AlInGaP and InGaN die  Surface mount device with ultra small 1.0 × 1.0mm footprint  Suitable for application that requires small pitch size  Compatible with reflow soldering  Taped in 8mm carrier tape on a 7 inch diameter reel Package Dimensions Pin4 1.05 Pin1 0.65 B G 1.05 R Pin3 Pin2 Resin PCB Pin1 (0.3) 0.29 Pin2 Pin4 0.29 B GR Pin4 Pin3 Pin2 Pin3 Pin1 NOTE All dimensions in millimeters. Tolerance is ±0.1 mm unless otherwise specified. CAUTION This LED is class 1A ESD sensitive per ANSI/ESDA/JEDEC JS-001. Please observe appropriate pr.


2019-02-20 : AIC3632    AT5009    AT0009    AT5050    DT5016    DT0016    AIT8328    AT0050    DT5003    DT0003   


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