www.DataSheet.co.kr
IC264 Series (Open Top)
Specifications
Ball Grid Array (BGA, 1.50mm Pitch)
Part Number (Details)
...
www.DataSheet.co.kr
IC264 Series (Open Top)
Specifications
Ball Grid Array (BGA, 1.50mm Pitch)
Part Number (Details)
1,000MW min. at 100V DC Insulation Resistance: Dielectric Withstanding
Voltage: 100V AC for 1 minute Contact Resistance: 1 W max. at 10mA/20mV max. Operating Temperature Range: –40°C to +150°C 10,000 insertions min. Mating Cycles: 225 contact pins Pin Count: 25g to 35g per individual Contact Force: contact pin
IC264
Series No.
- 225 01 - 1 - ** - MF
No. of Contact Pins Design Number NN: Without Positioning Pin #1, #2 NP: Without Positioning Pin #1, With Positioning Pin #2 PN: With Positioning Pin #1, Without Positioning Pin #2 Blank: With Positioning Pin #1, #2 MF = Flanged Unmarked = Not Flanged
Materials and Finish
Housing: Polyetherimide (PEI), glass-filled Contacts: Beryllium Copper (BeCu) Plating: Gold over Nickel
Outline Socket Dimensions
56.0±0.1 50.0 25.0
4- Æ2.8
(1.5±0.1)x14=21.0±0.15
57.0 37.6±0.1
4-R 3.0
Recommended PC Board Layout Matching IC Dimensions IC264-22501-1-**-**
56.0±0.05 4- Æ2.8
+0.1 0
13.0±0.1
Top View from Socket
4- Æ2.0 32.5±0.05
+0.1 0
2- 1.5x14=21.0±0.1
37.6±0.05
13.0±0.05
25.4±0.05
+0.1 0
1.50x14=21.00 27.00 ±0.2
225- Æ0.6
+0.1 0
28.0±0.05
2- Æ1.5
Test & Burn-In
SPECIFICATIONS ARE SUBJECT TO ALTERATION WITHOUT PRIOR NOTICE – DIMENSIONS IN MILLIMETER
28.0±0.05
Datasheet pdf http://www.DataSheet4U.net/ -
1.50±0.1
1.5±0.05
Æ0.75±0.1
1.30~1.80
0.60±0.1
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