PD - 97219
IRF6636PbF IRF6636TRPbF
l l l l l l l l l
RoHs Compliant Lead-Free (Qualified up to 260°C Reflow) Application Specific MOSFETs Ideal for CPU Core DC-DC Converters Low Conduction Losses High Cdv/dt Immunity Low Profile (<0.7mm) Dual Sided Cooling Compatible Compatible with existing Surface Mount Techniques
DirectFET Power MOSFET
Typical values (unless otherwise specified)
VDSS Qg
tot
VGS Qgd
6.1nC
RDS(on) Qgs2
1.9nC
RDS(on) Qoss
10nC
20V max ±20V max 3.2mΩ@ 10V 4.6mΩ@ .
Power MOSFET
PD - 97219
IRF6636PbF IRF6636TRPbF
l l l l l l l l l
RoHs Compliant Lead-Free (Qualified up to 260°C Reflow) Application Specific MOSFETs Ideal for CPU Core DC-DC Converters Low Conduction Losses High Cdv/dt Immunity Low Profile (<0.7mm) Dual Sided Cooling Compatible Compatible with existing Surface Mount Techniques
DirectFET Power MOSFET
Typical values (unless otherwise specified)
VDSS Qg
tot
VGS Qgd
6.1nC
RDS(on) Qgs2
1.9nC
RDS(on) Qoss
10nC
20V max ±20V max 3.2mΩ@ 10V 4.6mΩ@ 4.5V
Qrr
7.3nC
Vgs(th)
1.8V
18nC
ST
Applicable DirectFET Outline and Substrate Outline (see p.7,8 for details) SQ SX ST MQ MX MT
DirectFET ISOMETRIC
Description
The IRF6636PbF combines the latest HEXFET® Power MOSFET Silicon technology with the advanced DirectFETTM packaging to achieve the lowest on-state resistance in a package that has the footprint of a MICRO-8 and only 0.7 mm profile. The DirectFET package is compatible with existing layout geometries used in power applications, PCB assembly equipment and vapor phase, infra-red or convection soldering techniques, when application note AN-1035 is followed regarding the manufacturing methods and processes. The DirectFET package allows dual sided cooling to maximize thermal transfer in power systems, improving previous best thermal resistance by 80%. The IRF6636PbF balances both low resistance and low charge along with ultra low package inductance to reduce both conduction and switching losses. The reduced total losses make th.