Module. ISP0912 Datasheet

ISP0912 Datasheet PDF

Part ISP0912
Description Bluetooth Low Energy Module
Feature ISP091201 Bluetooth Low Energy Module with Integrated Antenna This LGA module, 8 x 12 x 1.5 mm, is b.
Manufacture Insight SiP
Datasheet
Download ISP0912 Datasheet





ISP0912
ISP091201
Bluetooth Low Energy Module
with Integrated Antenna
This LGA module, 8 x 12 x 1.5 mm, is based on the
nRF8001 µBlue Chip. Combined with an external MCU,
this module integrating an optimized antenna offers the
perfect solution for Bluetooth connectivity. The
solution is best in class for RF performance and low
power consumption. SPI and UART interfaces are
available for easy communication and give the
opportunity to add BLE connectivity to any designs.
Key Features
Single Mode BLE V4.0 Slave
Based on Nordic Semiconductor nRF8001
µBlue products
2.4GHz low energy RF Transceiver
Includes Software stack
Ultra Low Power Consumption
Single 1.9 to 3.6 V supply
Very small size 8.0 x 12.0 x 1.5 mm
Temperature -40 to +85 °C
Fully integrated RF matching and Antenna
Integrated 16 MHz Crystal Oscillator
Possibility to connect external 32.768 kHz
crystal or reference
Possibility to enable DC-DC converter by
adding external passive components
Applications
Connected sensors for medical devices,
healthcare, sport, fitness, industrial …
IoT applications, connected objects
Wearable technology
Home automation
Beacons
Certifications
FCC limited modular certification
Fully CE pre-certified module
Fully IC pre-certified module
Fully TELEC pre-certified module
KCC limited modular certification
Bluetooth SIG certified QDL listing
RoHS compliant
January 12, 2017
Page 1/22
Document Ref: isp_ble_DS091201_R21.docx
Insight SiP Green Side 400 avenue Roumanille BP 309 06906 Sophia-Antipolis Cedex France www.insightsip.com
The information contained in this document is the property of Insight SiP and should not be disclosed to any third party without written permission.
Specification subject to change without notice.



ISP0912
BLE MODULE
ISP091201
Contents
1. Block Diagram ............................................................................................................................................................3
2. Specifications.............................................................................................................................................................4
2.1. Absolute Maximum Ratings...........................................................................................................................4
2.2. Operating Conditions.....................................................................................................................................4
2.3. Power Consumption ......................................................................................................................................4
2.4. Clock Sources ...............................................................................................................................................5
2.5. Radio Specifications ......................................................................................................................................5
2.6. Electrical Schematic ......................................................................................................................................7
3. Pin Description...........................................................................................................................................................8
4. Mechanical Outlines................................................................................................................................................10
4.1. Mechanical Dimensions ..............................................................................................................................10
4.2. SMT Assembly Guidelines ..........................................................................................................................11
4.3. Antenna Keep-Out Zone .............................................................................................................................12
5. Product Development Tools ..................................................................................................................................13
5.1. Interface.......................................................................................................................................................13
5.2. Hardware .....................................................................................................................................................13
5.3. Development Tools and Software ...............................................................................................................13
6. Packaging & Ordering information.......................................................................................................................14
6.1. Marking........................................................................................................................................................14
6.2. Prototype Packaging ...................................................................................................................................14
6.3. Jedec Trays .................................................................................................................................................14
6.4. Tape and Reel .............................................................................................................................................15
6.5. Ordering Information ...................................................................................................................................16
7. Storage & Soldering information ..........................................................................................................................17
7.1. Storage and Handling..................................................................................................................................17
7.2. Moisture Sensitivity .....................................................................................................................................17
7.3. Soldering information ..................................................................................................................................18
8. Quality & User information.....................................................................................................................................19
8.1. Certifications................................................................................................................................................19
8.2. USA - FCC Grant Conditions and User Information....................................................................................19
8.3. Canada User Information .........................................................................................................................21
8.4. Korea - KCC Grant Conditions and User Information .................................................................................21
8.5. Discontinuity ................................................................................................................................................22
8.6. Disclaimer....................................................................................................................................................22
January 12, 2017
Page 2/22
Document Ref: isp_ble_DS091201_R21.docx
Insight SiP Green Side 400 avenue Roumanille BP 309 06906 Sophia-Antipolis Cedex France www.insightsip.com
The information contained in this document is the property of Insight SiP and should not be disclosed to any third party without written permission.
Specification subject to change without notice.




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