SEMICONDUCTOR
TECHNICAL DATA
GENERAL DESCRIPTION
This Trench MOSFET has better characteristics, such as fast switching t...
SEMICONDUCTOR
TECHNICAL DATA
GENERAL DESCRIPTION
This Trench
MOSFET has better characteristics, such as fast switching time, low on resistance, low gate charge and excellent avalanche characteristics. It is mainly suitable for power management in PC, portable equipment and battery powered systems.
FEATURES VDSS=40V, ID=7A. Drain to Source on Resistance. RDS(ON)=25m (Max.) @VGS=10V RDS(ON)=45m (Max.) @VGS=4.5V
Maximum Ratings (Ta=25 Unless otherwise noted)
CHARACTERISTIC
SYMBOL PATING UNIT
Drain to Source
Voltage
Gate to Source
Voltage
Drain Current
Ta=25 (Note1) Pulsed
VDSS VGSS
ID IDP
40 V 20 V 7A 36 A
Drain to Source Diode Forward Current
IS 7 A
Ta=25 (Note1) Drain Power Dissipation
Ta=100 (Note1)
Maximum Junction Temperature
Storage Temperature Range
2W PD
1.44 W
Tj -55~150
Tstg -55~150
Thermal Resistance, Junction to Ambient(Note1) RthJA 62.5 /W
Note1) Surface Mounted on 1 1 FR4 Board., t 10sec
KMB7D0DN40QB
Dual N-Ch Trench
MOSFET
DP
H T
G
U
L
A
DIM MILLIMETERS
A 4.85+_ 0.2
85
B1 3.94+_ 0.2 B2 6.02+_ 0.3
B1 B2
D 0.4+_ 0.1 G 0.15+0.1/-0.05
14
H 1.63+_ 0.2 L 0.65+_ 0.2
P 1.27
T 0.20+0.1/-0.05
U 0.1 MAX
FLP-8
KMB7D0DN 40QB
PIN CONNECTION (TOP VIEW)
S1 1 G1 2 S2 3 G2 4
8 D1 7 D1 6 D2 5 D2
1 2 3
4
8
7 6 5
2012. 1. 13
Revision No : 0
1/5
KMB7D0DN40QB
ELECTRICAL CHARACTERISTICS (Ta=25 ) UNLESS OTHERWISE NOTED
CHARACTERISTIC Static
SYMBOL
TEST CONDITION
Drain to Source Breakdown
Voltage Drain Cut-off Current Gate to Source Leakage Cu...