MachXO. LCMXO256 Datasheet

LCMXO256 Datasheet PDF


Part Number

LCMXO256

Description

MachXO

Manufacture

Lattice Semiconductor

Total Page 30 Pages
Datasheet
Download LCMXO256 Datasheet


LCMXO256
MachXO Family Data Sheet
Version 02.3_4W February 2007

LCMXO256
MachXO Family Data Sheet
Introduction
April 2006
Data Sheet
Features
Non-volatile, Infinitely Reconfigurable
• Instant-on – powers up in microseconds
• Single chip, no external configuration memory
required
• Excellent design security, no bit stream to
intercept
• Reconfigure SRAM based logic in milliseconds
• SRAM and non-volatile memory programmable
through JTAG port
• Supports background programming of
non-volatile memory
Sleep Mode
• Allows up to 100x static current reduction
TransFR™ Reconfiguration (TFR)
• In-field logic update while system operates
High I/O to Logic Density
• 256 to 2280 LUT4s
• 73 to 271 I/Os with extensive package options
• Density migration supported
• Lead free/RoHS compliant packaging
Embedded and Distributed Memory
• Up to 27.6 Kbits sysMEM™ Embedded Block
RAM
• Up to 7.5 Kbits distributed RAM
• Dedicated FIFO control logic
Flexible I/O Buffer
• Programmable sysIO™ buffer supports wide
range of interfaces:
LVCMOS 3.3/2.5/1.8/1.5/1.2
LVTTL
PCI
LVDS, Bus-LVDS, LVPECL, RSDS
sysCLOCK™ PLLs
• Up to two analog PLLs per device
• Clock multiply, divide, and phase shifting
System Level Support
• IEEE Standard 1149.1 Boundary Scan
• Onboard oscillator
• Devices operate with 3.3V, 2.5V, 1.8V or 1.2V
power supply
• IEEE 1532 compliant in-system programming
Introduction
The MachXO is optimized to meet the requirements of
applications traditionally addressed by CPLDs and low
capacity FPGAs: glue logic, bus bridging, bus interfac-
ing, power-up control, and control logic. These devices
bring together the best features of CPLD and FPGA
devices on a single chip.
Table 1-1. MachXO Family Selection Guide
Device
LCMXO256
LUTs
256
Dist. RAM (Kbits)
2.0
EBR SRAM (Kbits)
0
Number of EBR SRAM Blocks (9 Kbits)
0
VCC Voltage
Number of PLLs
1.2/1.8/2.5/3.3V
0
Max. I/O
78
Packages
100-pin TQFP (14x14 mm)
78
144-pin TQFP (20x20 mm)
100-ball csBGA (8x8 mm)
78
132-ball csBGA (8x8 mm)
256-ball ftBGA/fpBGA (17x17 mm)
324-ball ftBGA (19x19 mm)
1. fpBGA package
LCMXO640
640
6.0
0
0
1.2/1.8/2.5/3.3V
0
159
74
113
74
101
1591
LCMXO1200
1200
6.25
9.2
1
1.2/1.8/2.5/3.3V
1
211
73
113
101
211
LCMXO2280
2280
7.5
27.6
3
1.2/1.8/2.5/3.3V
2
271
73
113
101
211
271
© 2006 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal. All other brand
or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice.
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1-1
Introduction_01.2





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