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LDH543N00KAB-700 Datasheet

Part Number LDH543N00KAB-700
Manufacturers Murata Manufacturing
Logo Murata Manufacturing
Description Chip Multilayer Delay Lines
Datasheet LDH543N00KAB-700 DatasheetLDH543N00KAB-700 Datasheet (PDF)

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  LDH543N00KAB-700   LDH543N00KAB-700






Chip Multilayer Delay Lines

!Note •PPleleaasseerreeaaddrraatitninggaanndd!!CCAAUUTTIOIONN((foforrsstotorraaggee,,ooppeerraatitningg,,rraatitningg,,ssooldldeerriningg,,mmoouunntitninggaannddhhaannddlilningg))ininththisisPcDatFalcoagtatolopgrteovepnretvsemnot ksimngokaindg/oarndb/uorrnbinugr,neintgc., etc. N91E7.pdf 03.5.13 •TThhisisccaatatalologghhaassoonnlylytytyppiciacal sl pspeecicficfiactaiotinosn.sTbheecraeufosree,thyeorueaisrenroeqsupeascteedfotrodaeptapirloevdesopuercpifircoadtuiocnt ss.pTehceifirceafotioren,spoleratosetranpsparocvt ethoeuarppprroodvuacl tsshpeeectifoicraptiroondsucotrstrpaencsifaiccatitohnesabpepfororevaolrsdheerientgf.or product specifications before ordering. Chip Multilayer Delay Lines Chip Multilayer Delay Lines 1 3.2±0.2 1.1±0.2 1.60±0.2 0.25+0.1/-0.15 0.5±0.1 This Delay Line was developed by applying ceramic (3) (2) (1) multilayering and hole technology. It consists of copper line and low dielectric constant material and incorporates metal shields. LDH series are very small (4) (8) (5) (6) (7) 0.25+0.1/-0.15 and made for use at high frequencies. 0.35±0.2 0.45±0.15 s Features (1)(3)(5)(7) : NC (2)(6) : GND (4)(8) : IN/OUT 1. High stability at high frequency (2GHz) 0.5±0.1 1.0±0.1 (in mm) 2. Small, thin and light, utilizing multilayer construction m3. Metal shield is built inside chip. 4. Reflow solderable o5. Supplied on tape Sheet4U.c0.6±0.1 .DataDirectional Input Mark (1) (2) (3) (8) (4) (7) (6) (5) 0.4±0.2 4.5±0.2 3.2±0.2 2.2±0.1 0.3±0.2 0.1±0.1 .


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