| Part Number | LPA6836V |
| Manufacturer | Filtronic Compound Semiconductors |
| Title | MEDIUM POWER PHEMT WITH SOURCE VIAS |
| Description | AND APPLICATIONS DIE SIZE: 15.4X14.2 mils (390x360 µm) DIE THICKNESS: 3.9 mils (100 µm) BONDING PADS: 3.0X3.0 mils (75x75 µm) The FPA6836V is an... |
| Features |
♦ 25 dBm Output Power at 1-dB Compression at 18 GHz ♦ 9.5 dB Power Gain at 18 GHz ♦ 55% Power-Added Efficiency ♦ Source Vias to Backside Metallization
DRAIN BOND PAD
LPA6836V
MEDIUM POWER PHEMT WITH SOURCE VIAS
GATE BOND PAD
• DESCRIPTION AND APPLICATIONS DIE SIZE: 15.4X14.2 mils (390x360 µm) ... |
| Datasheet | LPA6836V pdf datasheet |
| Part Number | LPA6836V |
| Manufacturer | Filtronic Compound Semiconductors |
| Title | MEDIUM POWER PHEMT WITH SOURCE VIAS |
| Description | AND APPLICATIONS DIE SIZE: 15.4X14.2 mils (390x360 µm) DIE THICKNESS: 3.9 mils (100 µm) BONDING PADS: 3.0X3.0 mils (75x75 µm) The FPA6836V is an. |
| Features |
♦ 25 dBm Output Power at 1-dB Compression at 18 GHz ♦ 9.5 dB Power Gain at 18 GHz ♦ 55% Power-Added Efficiency ♦ Source Vias to Backside Metallization
DRAIN BOND PAD
LPA6836V
MEDIUM POWER PHEMT WITH SOURCE VIAS
GATE BOND PAD
• DESCRIPTION AND APPLICATIONS DIE SIZE: 15.4X14.2 mils (390x360 µm) . |
| Datasheet | LPA6836V pdf datasheet |
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