LQFP64

64-Lead Low-Profile Plastic Quad Flat Pack Package (CFA) -10x10 mm Body [LQFP] With 6.2x6.2 mm Exposed Pad and 2.0 mm Foot Print; Micrel Legacy Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging 64X TIPS 0.20 C A-B D D D1 D A E1 4 N B E1 E A A NOTE 1 C SEATING PLANE A A2 A1 123 D1 4 TOP VIEW SIDE VIEW 4X 0.20 H A-B D 0.10 C H 64X 0.10 C D2 12 3 N E2 4X 0.20 e BOTTOM VIEW 64x b 0.08 C A-B D Microchip Technology Drawing C04-1080 Rev. A Sheet 1 of 2 © 2019 Microchip Technology Incorporated 64-Lead Low-Profile Plastic Quad Flat Pack Package (CFA) -10x10 mm Body [LQFP] With 6.2 mm Exposed Pad and 2.0 mm Foot Print; Micrel Legacy Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging α H θ c L (L1) SECTION A-A Number of Leads Lead Pitch Overall Height Units Dimension Limits N e A MILLIMETERS MIN NOM MAX 64 0.50 BSC - - 1.60 Notes: Standoff Molded Package Thickness Foot Length Footprint Foot Angle Overall Width Overall Length Molded Package Width Molded Package Length Exposed Pad Width Exposed Pad Length Lead Width Lead Thickness Mold Draft Angle Top A1 0.05 0.10 0.15 A2 1.35 1.40 1.45 L 0.45 0.60 0.75 L1 1.00 REF θ 0° 3.5° 7° E 12.00 BSC D 12.00 BSC E1 10.00 BSC D1 10.00 BSC E2 6.10 6.20 6.30 D2 6.10 6.20 6.30 b 0.17 0.22 0.27 c 0.09 ...