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LS159 Datasheet

Part Number LS159
Manufacturers SGS
Logo SGS
Description HIGH RELIABILITY TRANSISTOR ARRAY
Datasheet LS159 DatasheetLS159 Datasheet (PDF)

LINEAR INTEGRATED CIRCUIT HIGH RELIABILITY TRANSISTOR ARRAY The LS159 is an array of 5 NPN transistors on a common monolithic substrate in an SO-14 (14-lead plastic micropackage). This package is easily mounted on thick and thin film hybrid circuits. Two transistors are internally connected to form a differential amplifier. The transistors of the LS159 are well suited to low noise general purposes and to a wide variety of applications in low power systems in the DC through VHF range. They may b.

  LS159   LS159






Part Number LS156
Manufacturers SGS
Logo SGS
Description TELEPHONE SPEECH CIRCUIT
Datasheet LS159 DatasheetLS156 Datasheet (PDF)

LINEAR INTEGRATED CIRCUIT PRELIMINARY DATA TELEPHONE SPEECH CIRCUIT WITH MULTIFREOUENCY TONE GENERATOR INTERFACE The LS156 is a monolithic integrated circuit in 16-lead dual in-line plastic package to replace the hybrid circuit in telephone set. It works with the same type of transducers for both transmitter and receiver (typically piezoceramic capsules, but the device can work also with dynamic ones). Many of its electrical characteristics can be controlled by means of external components to me.

  LS159   LS159







Part Number LS150X03-A3
Manufacturers LG
Logo LG
Description XGA TFT LCD Module
Datasheet LS159 DatasheetLS150X03-A3 Datasheet (PDF)

LS150X03-A3 Liquid Crystal Display Product Specification SPECIFICATION FOR APPROVAL ( ) Preliminary Specification ( ¡ß ) Final Specification Title BUYER MODEL DID 15.0” XGA TFT LCD SUPPLIER * MODEL LG.Philips LCD Co., Ltd. LS150X03 A3 SUFFIX * When you obtain standard approval , please use the above model name without suffix. SIGNATURE / DATE APPROVED BY Paul. Lee / G. Manager REVIEWED BY DATE / S. G. Hong / S.Engineer PREPARED BY / Please return 1 copy for your confirmation with yo.

  LS159   LS159







Part Number LS1501-7R
Manufacturers Power-One
Logo Power-One
Description 100 Watt AC-DC Converters
Datasheet LS159 DatasheetLS1501-7R Datasheet (PDF)

S Series 100 Watt AC-DC Converters Input voltage range from 85…264 V AC 1 or 2 isolated outputs up to 48 V DC 4 kV AC I/O electric strength test voltage LGA • Rugged electrical and mechanical design • Wide input frequency range from 47...440 Hz • Operating ambient temperature range –40...71 °C with convection cooling Selection chart Output 1 Output 2 Input voltage Type Options Uo nom [V DC] 5.1 12 15 24 24 30 48 12 15 24 Io nom [A] 16 8 6.5 4.2 4 3.2 2 4 3.2 2 Uo nom [V DC] 12 15 24 Io no.

  LS159   LS159







Part Number LS150
Manufacturers SGS
Logo SGS
Description HIGH PERFORMANCE 80 dB COMPANDOR
Datasheet LS159 DatasheetLS150 Datasheet (PDF)

LINEAR INTEGRATED CIRCUIT HIGH PERFORMANCE 80 dB COMPANDOR The LS150 is a monolithic integrated circuit in 14-lead dual in-line ceramic and plastic packages; it per- forms signal level expansion in an 80-dB range [with an overall accuracy of ± 0.2 dB in a 60 dB range1 and, when used in the feedback path of an operational amplifier, it performs complementary signal compression. The LS150 has been designed to improve audio channel signal-to-noise ratio according to CCITT recommendations which req.

  LS159   LS159







HIGH RELIABILITY TRANSISTOR ARRAY

LINEAR INTEGRATED CIRCUIT HIGH RELIABILITY TRANSISTOR ARRAY The LS159 is an array of 5 NPN transistors on a common monolithic substrate in an SO-14 (14-lead plastic micropackage). This package is easily mounted on thick and thin film hybrid circuits. Two transistors are internally connected to form a differential amplifier. The transistors of the LS159 are well suited to low noise general purposes and to a wide variety of applications in low power systems in the DC through VHF range. They may be used as discrete components in conventional circuits; in addition they provide the very significant inherent integrated circuit advantages of close electrical and thermal matching. The device is also available with a ermetic goldchip (LS8159M) that is particularly suitable for professional and telecom applications, wherever very high MTBF are required. This performance is guaranteed by silicon nitride sealing of chip surface and Ti-Pt-Au metallization, protected with a double passivated layer,.


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