M14D2561616A

ESMT DDR II SDRAM (Preliminary) M14D2561616A (2S) 4M x 16 Bit x 4 Banks DDR II SDRAM Features JEDEC Standard VDD = 1.8V ± 0.1V, VDDQ = 1.8V ± 0.1V Internal pipelined double-data-rate architecture; two data access per clock cycle Bi-directional differential data strobe (DQS, DQS ); DQS can be disabled for single-ended data strobe operation. On-chip DLL Differential clock inputs (CLK and CLK ) DLL aligns DQ and DQS transition with CLK transition 1KB page size - Row address: A0 to A12 - Column address: A0 to A8 Quad bank operation CAS Latency : 3, 4, 5, 6, 7, 8, 9 Additive Latency: 0, 1, 2, 3, 4, 5, 6, 7 Burst Type : Sequential and Interleave Burst Length : 4, 8 All inputs except data & DM are sampled at the rising edge of the system clock(CLK) Data I/O transitions on both edges of data strobe (DQS) DQS is edge-aligned with data for READ; center-aligned with data for WRITE Data mask (DM) for write masking only Off-Chip-Driver (OCD) impedance adjustment On-Die-Termination for better s...