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MASW6030G Datasheet

Part Number MASW6030G
Manufacturers Tyco Electronics
Logo Tyco Electronics
Description GaAs DPDT Switch
Datasheet MASW6030G DatasheetMASW6030G Datasheet (PDF)

www.DataSheet4U.com RoHS Compliant MASW6030G V3 Pad Layout GaAs DPDT Switch DC - 6.0 GHz Features • • • • Low Insertion Loss, 0.5 dB Typical Fast Switching Speed, 4 ns Typical Ultra Low DC Power Consumption RoHS* Compliant Description MA/COM’s MASW6030G is a GaAs MMIC DPDT switch die. The MASW6030G is ideally used where low power consumption is required. Typical applications include transmit / receive switching, switch matrices and switched filter banks, WLAN IEEE 802.11a and 802.11 b/g syste.

  MASW6030G   MASW6030G






Part Number MASW6030G
Manufacturers MA-COM
Logo MA-COM
Description GaAs DPDT Switch
Datasheet MASW6030G DatasheetMASW6030G Datasheet (PDF)

MASW6030G GaAs DPDT Switch DC - 6.0 GHz Rev. V3 Features  Low Insertion Loss, 0.5 dB Typical  Fast Switching Speed, 4 ns Typical  Ultra Low DC Power Consumption  RoHS* Compliant Pad Layout Description MA/COM’s MASW6030G is a GaAs MMIC DPDT switch die. The MASW6030G is ideally used where low power consumption is required. Typical applications include transmit / receive switching, switch matrices and switched filter banks, WLAN IEEE 802.11a and 802.11 b/g systems. Other applications incl.

  MASW6030G   MASW6030G







GaAs DPDT Switch

www.DataSheet4U.com RoHS Compliant MASW6030G V3 Pad Layout GaAs DPDT Switch DC - 6.0 GHz Features • • • • Low Insertion Loss, 0.5 dB Typical Fast Switching Speed, 4 ns Typical Ultra Low DC Power Consumption RoHS* Compliant Description MA/COM’s MASW6030G is a GaAs MMIC DPDT switch die. The MASW6030G is ideally used where low power consumption is required. Typical applications include transmit / receive switching, switch matrices and switched filter banks, WLAN IEEE 802.11a and 802.11 b/g systems. Other applications include cordless phones and base stations. Ordering Information Part Number MASW6030G 1. Die quantity varies. Die Size - Inches (mm) Package DIE 1 0.048 x 0.038 x 0.010 (1.220 x 0.970 x 0.250) Bond Pad Dimensions 2,3 Bond Pad RF1, RF6 RF2, RF3, RF4, RF5, A, B GND Absolute Maximum Rating Parameter Control Value (A or B) Max Input RF Power Storage Temperature Max Operating Temperature Dimensions - Inches (mm) 0.005 x 0.005 (0.130 x 0.150) 0.004 x 0.004 (0.100 x 0.100) 0.005 x 0.013 (0.130 x 0.320) Absolute Maximum 0/-8 V +34 dBm (0.5 - 6.0 GHz with 0/-8 V CTL) -65°C to +175°C +175°C Schematic 2. Exceeding any one or combination of these limits may cause permanent damage to this device. 3. M/A-COM does not recommend sustained operation near these survivability limits. Truth Table 4,5 RF1 to RF6 to A 1 0 B 0 RF2 On Off RF3 Off On RF4 On Off RF5 Off On 1 4. 0 = 0 to –0.2 V, 1 = -5 V. 5. When an RF output port is “Off” it is shorted to ground through .


2007-07-27 : V6310    TDA7379    A3P060    A3P030    A3P125    A3P250    A3P400    A3P600    A3P1000    KPE-123   


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