Converter. MAX38640B Datasheet

MAX38640B Datasheet PDF

Part MAX38640B
Description 700mA nanoPower Buck Converter
Feature Click here for production status of specific part numbers. MAX38640/1/2/3/A/B EVALUATION KIT AVAILA.
Manufacture Maxim Integrated
Datasheet
Download MAX38640B Datasheet

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MAX38640B
Click here for production status of specific part numbers.
MAX38640/1/2/3/A/B
EVALUATION KIT AVAILABLE
Tiny
1.8V
-
5.5V Input, 330nA
nanoPower Buck
ICQo, n7v0e0rmteAr
General Description
The MAX3864xA/B are nanoPower family of ultra-low
330nA quiescent current buck (step-down) DC-DC con-
verters operating from 1.8V to 5.5V input voltage and sup-
porting load currents of up to 175mA, 350mA, 700mA with
peak efficiencies of 96%. While in shutdown, there is only
5nA of shutdown current. The devices offer ultra-low qui-
escent current, small total solution size, and high efficien-
cy throughout the load range. The MAX3864xA/B are ide-
al for battery applications where long battery life is a must.
The MAX3864xA/B family utilizes a unique control scheme
that allows ultra-low quiescent current and high efficiency
over a wide output current range. MAX38642 excludes ac-
tive discharge resistor in shutdown which allows the out-
put to be regulated or held high by another source or by
the charged output capacitor.
The MAX3864xA/B devices are offered in a space-saving
1.42mm x 0.89mm 6-pin wafer-level package (WLP) (2
x 3 bumps, 0.4mm pitch), as well as a 2mm x 2mm,
6-pin µDFN package. All parts are specified from -40°C to
+85°C.
Benefits and Features
● Extends Battery Life
• 330nA Ultra-Low Quiescent Supply Current
• 5nA Shutdown Current
• 96% Peak Efficiency and Over 88% at 10µA
● Easy to Use – Addresses Popular Operation
• 1.8V to 5.5V Input Range
• Preprogrammed VOUT from 0.5V to 5V
• Single Resistor Adjustable VOUT from 0.7V to 3.3V
• ±1.75% Output Voltage Accuracy
• Up to 175mA/350mA/700mA Load Current
● Protects System in Multiple Use Cases
• Reverse-Current Blocking in Shutdown
• Optional Active Discharge Feature
● Reduces Size and Increases Reliability
• -40°C to +85°C Temperature Range
• 2mm x 2mm 6-pin µDFN Package
• 1.42mm x 0.89mm, 0.4mm Pitch 6-pin (2 x 3) WLP
Ordering Information appears at end of data sheet.
Applications
● Portable Space-Constrained Consumer Products
● Wearable devices, Ultra-Low-Power IoT, NB IoT, and
BLE
● Single Li-ion and Coin Cell Battery Products
● Wired, Wireless, Industrial Products
Typical Operating Circuit
INPUT 1.8V-5.5V
CIN
10µF
2.2µH
IN LX OUT
MAX38640A
RSEL
EN GND
OUTPUT 1.8V
COUT
22µ F
RSEL
768kΩ
19-100410; Rev 0; 10/18



MAX38640B
MAX38640/1/2/3/A/B
Tiny 1.8V - 5.n5aVnIonPpouwt,e3r3B0uncAkICQ,o7n0ve0rmteAr
Absolute Maximum Ratings
IN, EN, RSEL, NC, OUT to GND.............................. -0.3V to +6V
LX RMS Current WLP ............................. -1.6ARMS to +1.6ARMS
LX RMS Current µDFN.................................. -1ARMS to +1ARMS
Continuous Power Dissipation - WLP (TA = +70°C) (Derate
10.5mW/°C above +70°C) ................................................ 840mW
Continuous Power Dissipation – µDFN (TA = +70°C) (Derate
4.5mW/°C above +70°C) ...............................................357.8mW
Operating Temperature Range .............................-40°C to +85°C
Maximum Junction Temperature ...................................... +150°C
Storage Temperature Range ..............................-65°C to +150°C
Lead Temperature (soldering, 10 seconds) ...................... +300ºC
Soldering Temperature (reflow) ........................................ +260°C
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these
or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may
affect device reliability.
Package Information
6 µDFN
Package Code
L622+1C
Outline Number
21-0164
Land Pattern Number
90-0004
Thermal Resistance, Four Layer Board:
Junction-to-Ambient (θJA)
Junction-to-Case Thermal Resistance (θJC)
223.6°C/W
122°C/W
For the latest package outline information and land patterns (footprints), go to www.maximintegrated.com/packages.
Note that a “+”, “#”, or “-” in the package code indicates RoHS status only. Package drawings may show a different
suffix character, but the drawing pertains to the package regardless of RoHS status.
Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a
four-layer board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/
thermal-tutorial.
6 WLP
Package Code
Outline Number
N60E1+2
21-100128
Land Pattern Number
Refer to Application Note 1891
Thermal Resistance, Four Layer Board:
Junction-to-Ambient (θJA)
95.15°C/W
For the latest package outline information and land patterns (footprints), go to www.maximintegrated.com/packages.
Note that a “+”, “#”, or “-” in the package code indicates RoHS status only. Package drawings may show a different
suffix character, but the drawing pertains to the package regardless of RoHS status.
Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a
four-layer board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/
thermal-tutorial.
www.maximintegrated.com
Maxim Integrated | 2




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