DatasheetsPDF.com

ML7050LA Datasheet

Part Number ML7050LA
Manufacturers OKI electronic componets
Logo OKI electronic componets
Description Bluetooth RF Transceiver IC
Datasheet ML7050LA DatasheetML7050LA Datasheet (PDF)

FEDL7050LA-02 1 Semiconductor ML7050LA Bluetooth RF Transceiver IC This version: June 2001 Previous  version: Sep. 2000 GENERAL DESCRIPTION The Oki ML7050LA is a highly integrated BluetoothTM radio transceiver designed to operate in the global 2.4 GHz Industrial, Scientific, and Medical (ISM) band. The ML7050LA architecture incorporates vital intermediate frequency (IF) and radio frequency (RF) circuits on a low cost, integration-friendly bulk CMOS process. Bluetooth technology directly suppo.

  ML7050LA   ML7050LA






Bluetooth RF Transceiver IC

FEDL7050LA-02 1 Semiconductor ML7050LA Bluetooth RF Transceiver IC This version: June 2001 Previous  version: Sep. 2000 GENERAL DESCRIPTION The Oki ML7050LA is a highly integrated BluetoothTM radio transceiver designed to operate in the global 2.4 GHz Industrial, Scientific, and Medical (ISM) band. The ML7050LA architecture incorporates vital intermediate frequency (IF) and radio frequency (RF) circuits on a low cost, integration-friendly bulk CMOS process. Bluetooth technology directly supports short range, wireless voice and data communications with 1 Mbps throughput performance in the public ISM band across many applications, employing rapid frequency hopping (1.6K hops/s) spread spectrum (FHSS) approach. The ML7050LA highly integrated CMOS Bluetooth RF transceiver LSI will establish a 2.4 to 2.5 GHz communication link compliant with Bluetooth Specification Version 1.1 and is packaged in the Oki 48-pin ball grid array (BGA) package requires only 7 mm x 7 mm of the systems critical board space. Oki’s Bluetooth LSI family includes baseband LSI (ML70511LA), System Development Kit (BT-SDK), firmware and software (BTS Pack1/2/3). Together, the RF LSI (ML7050LA) and baseband (ML70511LA) devices form a complete hardware solution optimized for low system cost, small form factor, and reduced power consumption Bluetooth applications. FEATURES • Circuit design based on the Bluetooth Specification Version 1.1. • CMOS process technology lowers system cost and simplifies future base.


2005-05-07 : MJ11021    MJ11021    MJ11021    MJ11022    MJ11022    MJ11028    MJ11028    MJ11028    MJ11029    MJ11029   


@ 2014 :: Datasheetspdf.com ::
Semiconductors datasheet search & download site (Privacy Policy & Contact)