DatasheetsPDF.com

MMBZ33VAWT1G Datasheet

Part Number MMBZ33VAWT1G
Manufacturers ON Semiconductor
Logo ON Semiconductor
Description Zener Diodes
Datasheet MMBZ33VAWT1G DatasheetMMBZ33VAWT1G Datasheet (PDF)

MMBZxxVAWT1G Series, SZMMBZxxVAWT1G Series Zener Diodes, 40 Watt Peak Power SC−70 Dual Common Anode Zeners These dual monolithic silicon Zener diodes are designed for applications requiring protection capability. They are intended for use in voltage and ESD sensitive equipment such as computers, printers, business machines, communication systems, medical equipment and other applications. Their dual junction common anode design protects two separate lines using only one package. These devices ar.

  MMBZ33VAWT1G   MMBZ33VAWT1G






Zener Diodes

MMBZxxVAWT1G Series, SZMMBZxxVAWT1G Series Zener Diodes, 40 Watt Peak Power SC−70 Dual Common Anode Zeners These dual monolithic silicon Zener diodes are designed for applications requiring protection capability. They are intended for use in voltage and ESD sensitive equipment such as computers, printers, business machines, communication systems, medical equipment and other applications. Their dual junction common anode design protects two separate lines using only one package. These devices are ideal for situations where board space is at a premium. Features • SC−70 Package Allows Either Two Separate Unidirectional Configurations or a Single Bidirectional Configuration • Standard Zener Breakdown Voltage Range: 15 − 33 V • Peak Power − 40 W @ 1.0 ms (Unidirectional), per Figure 5 Waveform • ESD Rating: − Class 3B (> 16 kV) per the Human Body Model − Class C (> 400 V) per the Machine Model • Low Leakage < 5.0 mA • Flammability Rating UL 94 V−0 • AEC−Q101 Qualified and PPAP Capable − SZMMBZxxVAWT1G • SZ Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements • These are Pb−Free Devices* Mechanical Characteristics: CASE: Void-free, transfer-molded, thermosetting plastic case FINISH: Corrosion resistant finish, easily solderable MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES: 260°C for 10 Seconds Package designed for optimal automated board assembly Small package size for high density applications Available in 8 mm Tape and Reel Use th.


2019-07-06 : MMBT2222LT1    BAV99    MMBT2222ALT1    1N4550    1N4551    1N4552    1N4553    1N3305    1N4549    1N4554   


@ 2014 :: Datasheetspdf.com ::
Semiconductors datasheet search & download site (Privacy Policy & Contact)