Features
• Planar Die Construction • Dual Isolated Zeners in Ultra-Small Surface Mount Package • Ideally Suited for Auto...
Features
Planar Die Construction Dual Isolated Zeners in Ultra-Small Surface Mount Package Ideally Suited for Automated Assembly Processes Lead Free/RoHS Compliant (Note 2) "Green" Device (Note 3 and 4)
MMBZ5221BS - MMBZ5259BS
200mW SURFACE MOUNT ZENER DIODE
Mechanical Data
Case: SOT-363 Case Material: Molded Plastic. UL Flammability Classification
Rating 94V-0 Moisture Sensitivity: Level 1 per J-STD-020D Terminals: Solderable per MIL-STD-202, Method 208 Lead Free Plating (Matte Tin Finish annealed over Alloy 42
leadframe). Polarity: See Diagram Marking Information: See Page 4 Ordering Information: See Page 4 Weight: 0.006 grams (approximate)
C1 NC A2
Top View
Maximum Ratings @TA = 25°C unless otherwise specified
Forward
Voltage
Characteristic
@ IF = 10mA
A1 NC C2
Device Schematic
Symbol VF
Value 0.9
Unit V
Thermal Characteristics
Characteristic Power Dissipation Thermal Resistance, Junction to Ambient Air Operating and Storage Temperature Range
(Note 1) (Note 1)
Symbol PD RθJA
TJ, TSTG
Value 200 625 -65 to +150
Unit mW °C/W °C
Notes:
1. Mounted on FR4 PC Board with recommended pad layout which can be found on our website at http://www.diodes.com/datasheets/ap02001.pdf. 2. No purposefully added lead. 3. Diodes Inc.'s "Green" policy can be found on our website at http://www.diodes.com/products/lead_free/index.php. 4. Product manufactured with Date Code UO (week 40, 2007) and newer are built with Green Molding Compound. Product manu...