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MMBZ5251BTW Datasheet

Part Number MMBZ5251BTW
Manufacturers PAN JIT
Logo PAN JIT
Description SURFACE MOUNT SILICON ZENER DIODES
Datasheet MMBZ5251BTW DatasheetMMBZ5251BTW Datasheet (PDF)

MMBZ5221BTW~MMBZ5262BTW SURFACE MOUNT SILICON ZENER DIODES VOLTAGE 2.4 to 51 Volts POWER 200 mWatts FEATURES • Planar Die Construction • 200mW Power Dissipation • Zener Voltages from 2.4~51V • Ideally Suited for Automated Assembly Processes • In compliance with EU RoHS 2002/95/EC directives MECHANICAL DATA • Case: SOT-363, Plastic • Terminals: Solderable per MIL-STD-750, Method 2026 • Approx. Weight: 0.0002 ounces, 0.006 grams MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS (TJ=25OC unless other.

  MMBZ5251BTW   MMBZ5251BTW






Part Number MMBZ5251BTS
Manufacturers Diodes
Logo Diodes
Description TRIPLE SURFACE MOUNT ZENER DIODE ARRAY
Datasheet MMBZ5251BTW DatasheetMMBZ5251BTS Datasheet (PDF)

Features  Three Isolated Zeners in Ultra-Small Surface Mount Package  Ideally Suited for Automated Assembly Processes  Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2)  Halogen and Antimony Free. “Green” Device (Note 3)  Qualified to AEC-Q101 Standards for High Reliability MMBZ5221BTS - MMBZ5259BTS TRIPLE SURFACE MOUNT ZENER DIODE ARRAY Mechanical Data  Case: SOT363  Case Material: Molded Plastic. UL Flammability Classification Rating 94V-0  Moisture Sensitivity: Level 1 per J-STD.

  MMBZ5251BTW   MMBZ5251BTW







Part Number MMBZ5251BT
Manufacturers Diodes
Logo Diodes
Description 150mW SURFACE MOUNT ZENER DIODE
Datasheet MMBZ5251BTW DatasheetMMBZ5251BT Datasheet (PDF)

Features • Ultra-Small Surface Mount Package • Planar Die Construction • General Purpose • Ideally Suited for Automated Assembly Processes • Lead Free/RoHS Compliant (Note 2) • "Green" Device (Note 3 and 4) MMBZ5221BT - MMBZ5259BT 150mW SURFACE MOUNT ZENER DIODE Mechanical Data • Case: SOT-523 • Case Material: Molded Plastic. UL Flammability Classification Rating 94V-0 • Moisture Sensitivity: Level 1 per J-STD-020D • Terminals: Solderable per MIL-STD-202, Method 208 • Lead Free Plating (Matte T.

  MMBZ5251BTW   MMBZ5251BTW







SURFACE MOUNT SILICON ZENER DIODES

MMBZ5221BTW~MMBZ5262BTW SURFACE MOUNT SILICON ZENER DIODES VOLTAGE 2.4 to 51 Volts POWER 200 mWatts FEATURES • Planar Die Construction • 200mW Power Dissipation • Zener Voltages from 2.4~51V • Ideally Suited for Automated Assembly Processes • In compliance with EU RoHS 2002/95/EC directives MECHANICAL DATA • Case: SOT-363, Plastic • Terminals: Solderable per MIL-STD-750, Method 2026 • Approx. Weight: 0.0002 ounces, 0.006 grams MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS (TJ=25OC unless otherwise noted) PARAMETER Power Dissipation (Note A) Peak Forward Surge Current,8.3ms single half sine-wave superimposed on rated load (JEDEC method) (Notes B) Operating Junction Temperature and Storage Temperature Range SYMBOL PD IFS M TJ ,TSTG VALUE 200 2.0 -55 to +150 UNITS mW A OC NOTES: A. Mounted on 5.0mm2 (.013mm thick) land areas. B. Me asured on 8.3ms, single half sine-wave or equivalent square wave, duty cycle=4 pulses per minute maximum. October 06,2011-REV.02 PAGE .


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